24AA08-E/MC MICROCHIP [Microchip Technology], 24AA08-E/MC Datasheet

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24AA08-E/MC

Manufacturer Part Number
24AA08-E/MC
Description
8K IC SERIAL EEPROM
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
Device Selection Table
Features:
• Single supply with operation down to 1.8V
• Low-power CMOS technology:
• Organized as 4 blocks of 256 bytes (4 x 256 x 8)
• 2-wire serial interface bus, I
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (<2.5V) and 400 kHz ( 2.5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 16 bytes
• 2 ms typical write cycle time for page write
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP, DFN and MSOP
• 5-lead SOT-23 package
• Standard and Pb-free finishes available
• Available for extended temperature ranges:
© 2005 Microchip Technology Inc.
*24XX08 is used in this document as a generic part
number for the 24AA08/24LC08B devices.
Note 1:
24LC08B
Number
- 1 mA active current, typical
- 1 A standby current, typical (I-temp)
packages
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
24AA08
Part
100 kHz for V
1.8-5.5
2.5-5.5
Range
V
CC
CC
<2.5V
Frequency
Max Clock
400 kHz
2
400 kHz
C™ compatible
8K I
(1)
2
24AA08/24LC08B
Ranges
C
Temp
I, E
I
Serial EEPROM
Description:
The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low voltage
design permits operation down to 1.8V, with standby
and active currents of only 1 A and 1 mA,
respectively. The 24XX08 also has a page write
capability for up to 16 bytes of data. The 24XX08 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages, and is
also available in the 5-lead SOT-23 package.
Block Diagram
Package Types
V
A0
A1
A2
SDA
SCL
SS
SDA
Vss
Note:
I/O
V
V
Control
Logic
CC
SS
I/O
1
2
3
4
SCL
2
3
PDIP, MSOP
1
SOT-23-5
Pins A0, A1 and A2 are not used by the 24XX08. (No
internal connections).
WP
Control
Memory
5
4
Logic
8
7
6
5
WP
Vcc
V
WP
SCL
SDA
CC
V
A0
A1
A2
SS
V
XDEC
A2
A0
A1
SS
1
4
2
3
SOIC, TSSOP
1
2
3
4
DS21710D-page 1
DFN
Sense Amp.
R/W Control
Generator
EEPROM
Latches
Array
Page
YDEC
HV
8
7
6
5
8
7
6
5
V
WP
SCL
SDA
CC
WP
SCL
SDA
V
CC

Related parts for 24AA08-E/MC

24AA08-E/MC Summary of contents

Page 1

... Microchip Technology Inc. 24AA08/24LC08B 2 ™ C Serial EEPROM Description: The Microchip Technology Inc. 24AA08/24LC08B Temp (24XX08 Kbit Electrically Erasable PROM. The Ranges device is organized as four blocks of 256 x 8-bit (1) I memory with a 2-wire serial interface. Low voltage I, E design permits operation down to 1 ...

Page 2

... Package TypeElectrical Characteristics (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-65°C to +125°C ESD protection on all pins † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...

Page 3

... CC 1.8V V 2.5V (24AA08 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 2.5V V 5.5V (Note 1) CC 1.8V V 2.5V (24AA08) CC (Note 1) ns (Note 1) ns 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 (Note 2) ns 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 2.5V V 5.5V CC 1.8V V 2.5V (24AA08 (Notes 1 and 3) ms — DS21710D-page 3 ...

Page 4

... FIGURE 1-1: BUS TIMING DATA 5 3 SCL 7 6 SDA 14 IN SDA OUT FIGURE 1-2: BUS TIMING START/STOP SCL 6 7 SDA Start DS21710D-page Stop © 2005 Microchip Technology Inc. ...

Page 5

... SCL SDA Start Condition © 2005 Microchip Technology Inc. 24AA08/24LC08B 3.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal ...

Page 6

... Device Addressing A control byte is the first byte received following the Start condition from the master device (Figure 2-2). The control byte consists of a four-bit control code. For the 24XX08, this is set as ‘ binary for read and 1010’ write operations. The next three bits of the control byte are the block-select bits (B2, B1, B0 “ ...

Page 7

... R T SDA LINE S BUS ACTIVITY © 2005 Microchip Technology Inc. 24AA08/24LC08B 4.2 Page Write The write control byte, word address and the first data byte are transmitted to the 24XX08 in the same way byte write. However, instead of generating a Stop condition, the master transmits data bytes to ...

Page 8

... ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can then be initiated immediately ...

Page 9

... R T SDA LINE S BUS ACTIVITY © 2005 Microchip Technology Inc. 24AA08/24LC08B 7.3 Sequential Read Sequential reads are initiated in the same way as a random read, except that once the 24XX08 transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read. This directs the 24XX08 to transmit the next sequentially- addressed 8-bit word (Figure 6-3) ...

Page 10

... FIGURE 7-2: RANDOM READ S T BUS ACTIVITY Control A MASTER Byte SDA LINE BUS ACTIVITY FIGURE 7-3: SEQUENTIAL READ BUS ACTIVITY Control MASTER Byte Data (n) SDA LINE A C BUS ACTIVITY K DS21710D-page Word Control A Address (n) Byte Data ( ...

Page 11

... SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions. 8.2 Serial Clock (SCL) The SCL input is used to synchronize the data transfer to and from the device. © 2005 Microchip Technology Inc. 24AA08/24LC08B TSSOP DFN MSOP SOT- ...

Page 12

... Example: 24LC08B I/P13F 0527 Example: 24LC08B I/SN0527 13F Example: 4L08 I527 13F Device Example: 24AA08 4L08BI 24LC08B Y52713F Example: Device M43F 24AA08 24LC08B-I 24LC08B-E Note: TSSOP/MSOP Marking Codes STD Pb-free 4A08 G4A8 4L08 G4L8 SOT-23 Marking Codes STD Pb-free Pb-free part number using “ ...

Page 13

... Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. © 2005 Microchip Technology Inc. 24AA08/24LC08B Example: 244 527 13 DS21710D-page 13 ...

Page 14

... Plastic Dual In-line (P) – 300 mil (PDIP Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width ...

Page 15

... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 © 2005 Microchip Technology Inc. 24AA08/24LC08B Units ...

Page 16

... Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 17

... Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187 Drawing No. C04-111 © 2005 Microchip Technology Inc. 24AA08/24LC08B Units INCHES ...

Page 18

... Plastic Small Outline Transistor (OT) (SOT-23 Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 19

... Package may have one or more exposed tie bars at ends. 2. Pin 1 visual index feature may vary, but must be located within the hatched area. 3. Exposed pad dimensions vary with paddle size. 4. JEDEC equivalent: MO-229 Drawing No. C04-123 © 2005 Microchip Technology Inc. 24AA08/24LC08B b E EXPOSED METAL PAD BOTTOM VIEW A ...

Page 20

... APPENDIX A: REVISION HISTORY Revision C Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC08B standard marking code. Revision D Added DFN package. DS21710D-page 20 © 2005 Microchip Technology Inc. ...

Page 21

... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2005 Microchip Technology Inc. 24AA08/24LC08B CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...

Page 22

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA08/24LC08B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 23

... Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2005 Microchip Technology Inc. 24AA08/24LC08B X Examples: a) 24AA08-I/P: Industrial Temperature,1.8V, Lead Finish PDIP package b) 24AA08-I/SN: Industrial Temperature,1.8V, SOIC package 2 C Serial EEPROM c) 24AA08T-I/OT: Industrial Temperature Serial EEPROM 1.8V, SOT-23 package, Tape and Reel 2 ...

Page 24

... NOTES: DS21710D-page 24 © 2005 Microchip Technology Inc. ...

Page 25

... Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. ...

Page 26

W ORLDWIDE AMERICAS ASIA/PACIFIC Corporate Office Australia - Sydney 2355 West Chandler Blvd. Tel: 61-2-9868-6733 Chandler, AZ 85224-6199 Fax: 61-2-9868-6755 Tel: 480-792-7200 China - Beijing Fax: 480-792-7277 Tel: 86-10-8528-2100 Technical Support: Fax: 86-10-8528-2104 http://support.microchip.com China - Chengdu Web Address: Tel: ...

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