CY8C42000-24LFXI CYPRESS [Cypress Semiconductor], CY8C42000-24LFXI Datasheet - Page 38

• Manufacturer Part Number: CY8C42000-24LFXI
• Manufacturer: CYPRESS [Cypress Semiconductor]

9.1
9.2
Following is the minimum solder reflow peak temperature to achieve good solderability.
10.0 CY8C42x23 PSoC Device Key Features and Ordering Information
The following table lists the CY8C42x23 Power PSoC device’s key package features and ordering codes .
Document 38-12034 Rev. *C
* Thermal resistance from silicon junction to ambient (T
8-Pin SOIC
8-Pin SOIC Tape and Reel
16-Pin SOIC
16-Pin SOIC Tape and Reel
16-Pin TSSOP
16-Pin TSSOP Tape and Reel CY8C42323-24ZXIT
32-Pin QFN
32-Pin QFN Tape and Reel
32-Pin OCD QFN*
* This part may be used for in-circuit debugging. It is NOT available for production.
* Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5
Sn-Pb or 245+/-5
Thermal Impedances per Package
Solder Reflow Peak Temperature
16 TSSOP
16 TSSOP
Package
Package
16 SOIC
16 SOIC
32 QFN
32 QFN
8 SOIC
8 SOIC
o
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
CY8C42123-24SXI
CY8C42123-24SXIT
CY8C42223-24SXI
CY8C42223-24SXIT
CY8C42323-24ZXI
CY8C42423-24LFXI
CY8C42423-24LFXIT
CY8C42000-24LFXI*
PRELIMINARY
Minimum Peak
J
Temperature*
= T
Typical θ
186
124
122
A
22
240
240
240
240
+ POWER x
o
o
o
o
C/W
o
o
o
o
C/W
C/W
C/W
C
C
C
C
JA
4K
4K
4K
4K
4K
4K
4K
4K
4K
*
θ
JA
).
256
256
256
256
256
256
256
256
256
-40
-40
-40
-40
-40
-40
-40
-40
-40
°
°
°
°
°
°
°
°
°
C to +85
C to +85
C to +85
C to +85
C to +85
C to +85
C to +85
C to +85
C to +85
Maximum Peak
Temperature
260
260
260
260
°
°
°
°
°
°
°
°
°
C
C
C
C
C
C
C
C
C
o
o
o
o
C
C
C
C
o
2
2
2
2
2
2
2
2
2
C with
CY8C42123/CY8C42223
CY8C42323/CY8C42423
4
4
4
4
4
4
4
4
4
2
2
2
2
2
2
2
2
2
10
10
10
10
10
4
4
8
8
Page 38 of 42
0
0
2
2
2
2
2
2
2
Yes
Yes
Yes
No
No
No
No
No
No