74LVC3GU04DC NXP [NXP Semiconductors], 74LVC3GU04DC Datasheet

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74LVC3GU04DC

Manufacturer Part Number
74LVC3GU04DC
Description
Triple inverter
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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Part Number
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Part Number:
74LVC3GU04DC
Manufacturer:
HITACHI
Quantity:
4 357
1. General description
2. Features
3. Ordering information
Table 1.
Type number
74LVC3GU04DP
74LVC3GU04DC
74LVC3GU04GT
74LVC3GU04GM
Ordering information
Package
Temperature range
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
The 74LVC3GU04 provides three inverters. Each inverter is a single stage with unbuffered
output.
Inputs can be driven from either 3.3 V or 5 V devices. These features allow the use of
these devices in a mixed 3.3 V and 5 V environment.
I
I
I
I
I
I
I
I
I
I
74LVC3GU04
Triple inverter
Rev. 05 — 5 October 2007
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
ESD protection:
CMOS low power consumption
Latch-up performance exceeds 250 mA
Multiple package options
Specified from 40 C to +85 C and from 40 C to +125 C.
N
N
N
N
N
24 mA output drive at V
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V)
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Name
TSSOP8
VSSOP8
XSON8
XQFN8
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
plastic extremely thin small outline package; no leads;
8 terminals; body 1
plastic extremely thin quad flat package; no leads;
8 terminals; body 1.6
CC
= 3.0 V
1.95
1.6
0.5 mm
0.5 mm
Product data sheet
Version
SOT505-2
SOT765-1
SOT833-1
SOT902-1

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74LVC3GU04DC Summary of contents

Page 1

... Multiple package options I Specified from +85 C and from +125 C. 3. Ordering information Table 1. Ordering information Type number Package Temperature range 74LVC3GU04DP +125 C 74LVC3GU04DC +125 C 74LVC3GU04GT +125 C 74LVC3GU04GM +125 Name Description TSSOP8 plastic thin shrink small outline package; 8 leads; ...

Page 2

... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74LVC3GU04DP 74LVC3GU04DC 74LVC3GU04GT 74LVC3GU04GM 5. Functional diagram mna720 Fig 1. Logic symbol Fig 3. Logic diagram (one gate) 74LVC3GU04_5 Product data sheet Marking code VU04 VU4 VU4 VU4 Fig 2. IEC logic symbol ...

Page 3

NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 74LVC3GU04 GND 4 Transparent top view Fig 5. Pin configuration SOT833-1 (XSON8) 6.2 Pin description Table 3. Pin ...

Page 4

NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System ...

Page 5

NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter +85 C amb V HIGH-level input voltage IH V LOW-level input ...

Page 6

NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I supply current CC [1] All typical values are ...

Page 7

NXP Semiconductors 12. Waveforms input M GND t PHL output Measurement points are given in V and V are typical output voltage levels that OL OH occur with the ...

Page 8

NXP Semiconductors 13. Additional characteristics --------- constant. O Fig 9. Test set-up for measuring forward transconductance amb Fig 10. Typical forward transconductance as a function of supply ...

Page 9

NXP Semiconductors 14. Application information Some applications for the 74LVC3GU04 are: • Linear amplifier (see • Crystal oscillator (see Remark: All values given are typical values unless otherwise specified. Z > ...

Page 10

NXP Semiconductors 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions ...

Page 11

NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 ...

Page 12

NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A ...

Page 13

NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area ...

Page 14

NXP Semiconductors 16. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 17. Revision history Table 12. Revision history Document ID ...

Page 15

NXP Semiconductors 18. Legal information 18.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 16

NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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