DS1554-100 DALLAS [Dallas Semiconductor], DS1554-100 Datasheet - Page 17

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DS1554-100

Manufacturer Part Number
DS1554-100
Description
256K NV Y2KC Timekeeping RAM
Manufacturer
DALLAS [Dallas Semiconductor]
Datasheet
AC TEST CONDITIONS
Output Load:
Input Pulse Levels:
Timing Measurement Reference Levels:
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1. Voltage referenced to ground.
2. Typical values are at 25 C and nominal supplies.
3. Outputs are open.
4. Battery switch over occurs at the lower of either the battery voltage or V
5. The
6. Data retention time is at 25 C.
7. Each DS1554 has a built-in switch that disconnects the lithium source until V
8. Real Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering
In addition, for the PowerCap:
9. t
10. t
user. The expected t
the absence of V
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85 C. Post solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3
AH1
AH1
Input: 1.5V
Output: 1.5V
solder reflow oriented with the label side up (“live-bug”).
seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
, t
, t
IRQ
DH1
DH1
/FT and
are measured from WE going high.
are measured from CE going high.
CC
RST
starting from the time power is first applied by the user.
DR
outputs are open drain.
is defined for DIP modules and PowerCap modules as a cumulative time in
100 pF + 1TTL Gate
0.0 to 3.0 Volts
17 of 21
PF
.
CC
is first applied by the
DS1554

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