VSC8061FC VITESSE [Vitesse Semiconductor Corporation], VSC8061FC Datasheet - Page 16

• Manufacturer Part Number: VSC8061FC
• Description: 2.5Gb/s 16-Bit Multiplexer/Demultiplexer Chipset
• Manufacturer: VITESSE [Vitesse Semiconductor Corporation]

Page 16
2.5Gb/s 16-Bit
Multiplexer/Demultiplexer Chipset
Thermal Considerations
packs. These packages have been enhanced to improve thermal dissipation through low thermal resistance paths
from the die to the exposed surface of the heat spreader. The thermal resistance of the two packages is shown in
the following table
Table 9: Thermal Resistance
Thermal Resistance with Airflow
mal paths including through the leads in an environment where the leads are exposed. The temperature differ-
ence between the ambient airflow temperature and the case temperature should be the worst case power of the
device multiplied by the thermal resistance.
Table 10: Thermal Resistance with Airflow
Thermal Resistance with Heat Sink
an example.
Symbol
JC
CA
The VSC8061 and VSC8062 are available in ceramic LDCC and thermally enhanced plastic quad flat-
Shown in Table 10 is the thermal resistance with airflow. This thermal resistance value reflects all the ther-
The determination of appropriate heat sink to use is as shown below, using the VSC8061 in QH package as
100 lfpm
200 lfpm
300 lfpm
Airflow
500 lfpm
Thermal resistance from junction-to -case.
Thermal resistance from case-to-ambient still air including
conduction through the leads.
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: [phone] • Email: [e-mail]
CA
VITESSE
SEMICONDUCTOR CORPORATION
Description
for F Package
Figure 11: VSC8061 in QH Package
15.9
14.9
14.2
13.3
SA
CS
T
A
Internet: www.vitesse.com
CA
F Pack
for QH Package
18.5
1.3
24
21
19
15
VSC8061/VSC8062
QH Pack
30.0
2.1
Data Sheet
Units
Units
o
o
o
o
G52069-0, Rev 4.3
C/W
C/W
C/W
C/W
C/W
C/W
05/11/01