LSC3100-DN HP [Agilent(Hewlett-Packard)], LSC3100-DN Datasheet

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LSC3100-DN

Manufacturer Part Number
LSC3100-DN
Description
14 Pin DIL Uncooled Laser Modules
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet
14 Pin DIL Uncooled Laser
Modules
Technical Data
Features
• Low Cost Plastic Package
• LSC3300: 100 W (-10 dBm)
• 1280 - 1330 nm Wavelength
• Hermetic Laser Module
• -40 C to +85 C Operation
Applications
• Telecommunications
• Local Area and Metropolitan
• Point to Point
• Fiber Optic Sensors
• Cable Television
• Military Communications
• Instrumentation
480
Laser Safety Warning
This device is a Class IIIb (3b) Laser Product. It may emit invisible laser radiation if operated with the fiber pigtail disconnected. To avoid
possible eye damage do not look into an unconnected fiber pigtail during laser operation. Do not exceed specified operating limits.
(14 Pin DIL)
Min. Power Output
LSC3100: 1 mW (0 dBm)
Min. Power Output
Area Networks
Datacommunications
and Control Systems
Description
LSC3X00 laser modules are high
reliability fiber optic light sources
operating in the 1300 nanometer
band. They are particularly well
suited for applications where low
power dissipation is required.
The internal semiconductor lasers
are based upon InGaAsP buried
heterostructure (BH) technology
and fabricated by the Metal-
Organic Vapor Phase Epitaxy
(MOVPE) process, resulting in
long lifetimes and modest
threshold currents.
The LSC3X00 package includes a
photodiode for monitoring the
laser output. A longhorn type
heatsink mounting flange is
incorporated in the industry
standard 14 pin DIL package.
Two basic varieties are offered
for alternative power ranges. The
“low power” LSC3300 covers the
power range between 100 W
and 625 W. The “high power”
LSC3100 uses the same laser
chip, but with tighter fiber
coupling to achieve output
powers from 1 mW to 2.5 mW.
The low cost outer package is
made feasible by our unique
design of hermetic miniature
laser submodule which houses
the electro-optic devices. The
submodule concept is used as a
building block in many other
Hewlett-Packard products
including cooled 1 mW 14 pin
lasers and DFB modules.
LSC3X00
5963-1125E (7/94)

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LSC3100-DN Summary of contents

Page 1

... The “low power” LSC3300 covers the power range between 100 W LSC3X00 and 625 W. The “high power” LSC3100 uses the same laser chip, but with tighter fiber coupling to achieve output powers from 2.5 mW. The low cost outer package is ...

Page 2

LSC3X00 Pin Connections and Block Diagram Top View NOT CONNECTED 1 NOT CONNECTED 2 NOT CONNECTED 3 NOT CONNECTED 4 CASE GROUND 5 NOT CONNECTED 6 MONITOR PHOTODIODE CATHODE (+ve SUPPLY) 7 LSC3X00 Mechanical Outline - Dimensions ...

Page 3

LSC3X00 Laser Diode Typical Operating Characteristics LASER FORWARD VOLTAGE vs. FORWARD CURRENT 1.2 1.0 0 FORWARD CURRENT (mA) THRESHOLD CURRENT vs. TEMPERATURE -30 - TEMPERATURE (°C) ...

Page 4

... LSC3X00 Laser Diode Typical Operating Characteristics MONITOR PHOTOCURRENT vs. OUTPUT POWER 700 600 500 400 300 200 100 0 100 200 LSC3300 FIBER POWER (µ LSC3100 FIBER POWER (mW) CONTINUOUS WAVE POWER vs. FORWARD CURRENT (25 °C) 400 300 200 100 0 300 400 0 10 FORWARD CURRENT (mA SPECTRAL CONTENT ...

Page 5

... Condition B Mil Std 883D, Method 2007, Condition A Conditions Min. 100 1280 3 dB Limits Min. Max. Units - 150 mA - 100 - -40 +85 -40 +85 0.0 non- %RH condensing - 10 LSC3300 LSC3100 Max. Min. Max. Units 1000 - 100 W/mA - 1 1330 1280 1330 ...

Page 6

... Hewlett-Packard can offer a ruggedized fiber pigtail for this product range if extreme mechanical strength is required. The pigtail length can be customized to your specific length, with a connector tolerance of 25 mm. LSC3300 Test Conditions Min. 25 0.25 - -1.5 Minimum Maximum 1.0 4.5 122 - 0.8 1150 LSC3100 Max. Min. Max. Units 800 50 800 A 8.0 0.05 0.8 A +1.5 -2 ...

Page 7

Ordering Information LSC3X00 - XX Connectors FC/PC Polish Biconic SA = SMA DIN SF = Super Polish FC/PC Power Range minimum 3 = 100 ...

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