AD53/009-9 AD [Analog Devices], AD53/009-9 Datasheet - Page 7

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AD53/009-9

Manufacturer Part Number
AD53/009-9
Description
GSM Baseband Processing Chipset
Manufacturer
AD [Analog Devices]
Datasheet
Mechanical Considerations
The chipset has been specifically designed to meet not only cost
and power consumption requirements but also attention was
paid to the physical dimensions. State-of-the-art package
technology was used to achieve smallest possible geometries. See
Table II for a list of main packaging dimensions and consult
individual data sheets of the three components for further
details.
Parameter
Package
Leads
Pitch
Body
Total Height
Board Area
All three components utilize low profile Plastic Quad Flat Packs
with lead pitches of 0.5 mm minimum. Special attention was
paid to the possible use in PCMCIA cards.
REV. 0
Table II. Package Dimensions
ASP
TQFP
100
0.5
14
1.6
16
14
16
PLP
TQFP
176
0.5
24
1.7
26
24
26
BBC
TQFP
80
0.65
14
1.6
16
14
16
mm
mm
mm
mm
Unit
2
2
–7–
ORDERING GUIDE
To order the parts for the AD20msp410 GSM chipset, please
order one of each of the following components.
Part
ASP
BBC
PLP
An evaluation and development system may be ordered for this
chipset, under the part number, AD20msp410-EB03.
Part Number
ADSP-2178-780244
AD53/009-9 (Special AD7015) +2.7 V to 3.6 V
ADPLP01
AD20msp410
Supply Voltage Range
+2.7 V to 3.6 V
+2.7 V to 3.6 V

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