MTB23P06 MOTOROLA [Motorola, Inc], MTB23P06 Datasheet
MTB23P06
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MTB23P06 Summary of contents
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... Preferred devices are Motorola recommended choices for future use and best overall value. Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1994 D G Rating Order this document by MTB23P06E/D MTB23P06E Motorola Preferred Device TMOS POWER FET 23 AMPERES 60 VOLTS R DS(on) = 0.12 OHM CASE 418B–02, Style 2 ...
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... MTB23P06E ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc Vdc 125 C) Gate–Body Leakage Current ( Vdc ...
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... C 1000 400 200 25 C 100 150 175 200 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–To–Source Leakage Current MTB23P06E – 150 DRAIN CURRENT (AMPS) ...
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... MTB23P06E Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...
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... DM ), the energy rating is specified at rated continuous cur- rent ( accordance with industry custom. The energy rat- ing must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at cur- rents below rated continuous I D can safely be assumed to equal the values indicated. MTB23P06E d(off d(on) 4 ...
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... MTB23P06E 100 SINGLE PULSE DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 0.5 0.5 0.3 0.2 0.2 0.1 0.05 0.1 0.02 0.05 0.03 0.01 0.02 SINGLE PULSE 0.01 0.01 0.02 0.05 0.1 0.2 di/ ...
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... Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MTB23P06E Board Material = 0.0625 G–10/FR– Copper ...
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... MTB23P06E Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the SC–59, SC– ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 18. Typical Solder Heating Profile MTB23P06E STEP 6 STEP 7 COOLING VENT 205 TO 219 C PEAK AT SOLDER JOINT T MAX 9 ...
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... DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.340 0.380 8.64 9.65 B 0.380 0.405 9.65 10.29 C 0.160 0.190 4.06 4.83 D 0.020 0.035 0.51 0.89 E 0.045 0.055 1.14 1.40 G 0.100 BSC 2.54 BSC H 0.080 0.110 2.03 2.79 J 0.018 0.025 0.46 0.64 K 0.090 0.110 2.29 2.79 S 0.575 0.625 14.60 15.88 V 0.045 0.055 1.14 1.40 MTB23P06E/D ...