la73b-1-3yg-s4-pf Ligitek Electronics Co., Ltd., la73b-1-3yg-s4-pf Datasheet
la73b-1-3yg-s4-pf
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la73b-1-3yg-s4-pf Summary of contents
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... LED ARRAY DOC QW0905-LA73B-1/3YG-S4-PF REV. DATE LIGITEK ELECTRONICS CO.,LTD. LA73B-1/3YG-S4-PF DATA SHEET : Jun. - 2008 Property of Ligitek Only Pb Lead-Free Parts ...
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... PART NO. LA73B-1/3YG-S4-PF Package Dimensions ψ 2.9X3 5.08 2.5 □ 0.5TYP 2.54TYP 1 1 LYG2662/H-PF 1.0MIN Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. 2.4 ± 0.5 4 3.5 ± 0.5 4.65 ± 0.5 7.15 ± 0.5 2 9.65 ± 0 2.9 3.3 1.5MAX ∅ ...
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... PART NO. LA73B-1/3YG-S4-PF Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 PART NO MATERIAL GaAsP/GaP Yellow LA73B-1/3YG-S4-PF GaP Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. ...
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... PART NO. LA73B-1/3YG-S4-PF Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Fig.2 Relative Intensity vs. Forward Current 3 ...
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... PART NO. LA73B-1/3YG-S4-PF Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...
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... PART NO. LA73B-1/3YG-S4-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° ...
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... PART NO. LA73B-1/3YG-S4-PF Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95% High Humidity Test 3.t=240hrs 1 ...