cspesd304 California Micro Devices Corporation, cspesd304 Datasheet - Page 5

• Manufacturer Part Number: cspesd304
• Description: 4-channel Esd Array In Csp
• Manufacturer: California Micro Devices Corporation

Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
© 2005 California Micro Devices Corp. All rights reserved.
09/27/05
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
Figure 4. Eutectic (SnPb) Solder
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Ball Reflow Profile
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Non-Solder Mask Defined Pad
Solder Stencil Opening
Solder Mask Opening
0.275mm DIA.
0.325mm DIA.
0.330mm DIA.
●
Tel: [phone]
250
200
150
100
50
Figure 5. Lead-free (SnAgCu) Solder
0
●
1:00.0
Fax: [phone]
Ball Reflow Profile
Non-Solder Mask defined pads
Time (minutes)
2:00.0
OSP (Entek Cu Plus 106A)
0.125mm - 0.150mm
0.330mm Round
0.325mm Round
50/50 by volume
60 seconds
CSPESD304
0.275mm
No Clean
●
3:00.0
VALUE
+50µm
+20µm
Round
240°C
260°C
www.cmd.com
4:00.0
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