MCL2AHTTD082M KOA [KOA Speer Electronics, Inc.], MCL2AHTTD082M Datasheet - Page 4

• Manufacturer Part Number: MCL2AHTTD082M
• Description: Multi Layer Ferrite Inductors
• Manufacturer: KOA [KOA Speer Electronics, Inc.]

5. Characteristics
Bolivar Drive
Spec ific ation s g iven herein m ay be cha nged a t any tim e w itho ut pr ior not ice. Pleas e c onf ir m te chnic al s pec if ica tions before you order an d/or u se.
Item
Operating Temperature
Storage Temperature
Resistance to Solder
Heat
Solderability
Leach Resistance
Insulation Resistance
Solvent Resistance
Terminal Strength
(hanging test)
Terminal Strength
(push test)
Bending Strength
P.O. Box 547
Requirement
-25°C ~ +85°C
40°C @ 70% Humidity
Change in Inductance: Relative to value before
test ±20%.
Appearance: There shall be no cracking
Solder Coverage: More than 75% of the terminal
electrode shall be covered with solder.
Solder Coverage: More than 95% of the
termination shall be covered with solder.
Appearance: There shall be no visible signs of
physical or mechanical damage (i.e. no cracks)
Terminations: Termination must not be leached
away for more than 5%.
Insulation Resistance: Min 1G ohms
Change in Inductance: Relative to value before
test ±10%.
Appearance: The terminal electrode shall not
break off, nor shall there be damage to the body.
Appearance: There shall be no evidence of
mechanical degradations to terminals or body.
Appearance: There shall be no physical or
mechanical damage
Inductance: Relative to initial value before
test ±10%
Bradford, PA 16701
USA
814-362-5536
Conditions
Sealed plastic bags with desiccant shall be
used to reduce the potential of oxidation on
the terminations during storage.
Flux: 5-10 sec dip
After Flux: Air dry for 15 sec
Preheat: 150°C ±10°C
Preheat Time: 60 sec
Solder Temp: 260°C ±5°C
Dip Time: 10 ±1 sec
Flux: 5-10 sec dip
After Flux: Air dry for 15 sec
Solder Temp: 245°C ±5°C
Dip Time: 5 ±0.5 sec
The bead shall be subjected to the following
5 steps for the period of time shown below.
The 5 steps constitute one (1) rotation.
4 rotations shall be carried out.
1) Flux: 5-10 sec
2) After Flux: Air dry for 15 sec
3) Solder Temp: 230°C ±5°C
4) Dip Time: 5 ±0.5 sec
5) Cool: Air cool for 60 seconds
Cleaning by:
Washer: Ultrasonic washer (100W)
Solvent: Isopropyl alcohol
Time: 3 minutes
Board: 90x40x1.6mm
Bend: 1mm
Time: 5 sec
2A (0805)
2B (1206)
2A (0805)
2B (1206)
1J (0603)
1J (0603)
Type
Type
Fax [phone]
W(kgf)
W(kgf)
0.5
1.0
1.5
1.4
1.8
2.3
www.koaspeer.com
30 sec ±2 sec
30 sec ±2 sec
30 sec ±2 sec
60 sec
60 sec
60 sec
PAGE 4 OF 6
Time
Time
SS-223 R9