mf1splusx0y1 NXP Semiconductors, mf1splusx0y1 Datasheet - Page 3
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mf1splusx0y1
Manufacturer Part Number
mf1splusx0y1
Description
Mainstream Contactless Smart Card Ic For Fast And Easy Solution Development
Manufacturer
NXP Semiconductors
Datasheet
1.MF1SPLUSX0Y1.pdf
(17 pages)
NXP Semiconductors
5. Ordering information
Table 2.
MF1SPLUSX0Y1_SDS_31
Product short data sheet
PUBLIC
Type number
MF1SPLUS8001DUD/03 FFC
MF1SPLUS8001DA4/03
MF1SPLUS8011DUD/03 FFC
MF1SPLUS8011DA4/03
MF1SPLUS8021DUD/03 FFC
MF1SPLUS8021DA4/03
MF1SPLUS6001DUD/03 FFC
MF1SPLUS6001DA4/03
MF1SPLUS6011DUD/03 FFC
MF1SPLUS6011DA4/03
MF1SPLUS6021DUD/03 FFC
MF1SPLUS6021DA4/03
Ordering information
Package
Commercial
Name
MOA4
MOA4
MOA4
MOA4
MOA4
MOA4
Name
-
-
PLLMC
-
-
-
PLLMC
-
PLLMC
PLLMC
PLLMC
PLLMC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 19 April 2010
Description
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
UID0 = XFh according to ISO/IEC 14443-3
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 4-byte UID, UID0 = XFh according to
ISO/IEC 14443-3
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
UID0 = XFh according to ISO/IEC 14443-3
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 4-byte UID, UID0 = XFh according to
ISO/IEC 14443-3
187031
Ref.
Ref.
Ref.
Ref.
Ref.
Ref.
3, 4 kB EEPROM, 7-byte UID
3, 4 kB EEPROM, 4-byte UID
3, 4 kB EEPROM, 4-byte UID,
3, 2 kB EEPROM, 7-byte UID
3, 2 kB EEPROM, 4-byte UID
3, 2 kB EEPROM, 4-byte UID,
Mainstream contactless smart card IC
MF1SPLUSx0y1
© NXP B.V. 2010. All rights reserved.
Version
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
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