hsms-a100-j80j2 ETC-unknow, hsms-a100-j80j2 Datasheet - Page 9

• Manufacturer Part Number: hsms-a100-j80j2
• Description: Surface Mount Indicator
• Manufacturer: ETC-unknow

Figure 6. Forward voltage shift vs. temperature.
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 9. Recommended wave soldering profile.
9
-0.1
-0.2
-0.3
0.5
0.4
0.3
0.2
0.1
250
200
150
100
50
30
0
-100
0
100-150°C
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
GaP/AlGaAs/
AlInGaP
3°C/SEC. MAX.
10
-50
120 SEC. MAX.
20 SEC. MAX.
FLUXING
TEMPERATURE – °C
3°C/SEC.
TURBULENT WAVE
240°C MAX.
PREHEAT
20
MAX.
InGaN/GaN
0
30
TIME
TIME – SECONDS
40
50
60-150 SEC.
50
100
60
150
70
183°C
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
–6°C/SEC.
80
MAX.
90
100
2.60
Figure 7. Radiation Pattern.
Figure 10. Recommended soldering pad pattern.
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 8b. Recommended Pb-free reflow soldering profile.
1.0
0.8
0.6
0.4
0.2
0
-90
217 °C
125 °C ± 25 °C
-80
SOLDER RESIST
3 °C/SEC. MAX.
MAX. 120 SEC.
-70
-60
1.50
255 °C
-50
ANGULAR DISPLACEMENT – DEGREES
+5 °C
TIME
-0 °C
-40
-30
4.50
-20
-10
10 to 20 SEC.
60 to 150 SEC.
0
6 °C/SEC. MAX.
10
20 30
40
50
60
70
80
90