buk95r2-40b NXP Semiconductors, buk95r2-40b Datasheet
buk95r2-40b
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buk95r2-40b Summary of contents
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BUK95/96/9E3R2-40B TrenchMOS™ logic level FET Rev. 04 — 14 November 2003 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a plastic package using Philips High-Performance Automotive TrenchMOS™ technology. 1.2 Features Very low on-state resistance 175 C ...
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Philips Semiconductors 3. Ordering information Table 2: Ordering information Type number Package Name Description BUK953R2-40B TO-220AB Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB 2 BUK963R2-40B D -PAK Plastic single-ended surface mounted package (Philips version ...
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Philips Semiconductors 120 P der (%) 100 P tot P = ---------------------- - 100% der P tot 25 C Fig 1. Normalized total power dissipation as a function of mounting base temperature ...
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Philips Semiconductors 5. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from junction to mounting th(j-mb) base R thermal resistance from junction to ambient th(j-a) SOT78 (TO-220AB) 2 SOT404 (D -PAK) 2 SOT226 (I -PAK) 5.1 Transient ...
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Philips Semiconductors 6. Characteristics Table 5: Characteristics unless otherwise specified. j Symbol Parameter Static characteristics V drain-source breakdown (BR)DSS voltage V gate-source threshold voltage I GS(th) I drain-source leakage current DSS I gate-source leakage current GSS ...
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Philips Semiconductors Table 5: Characteristics …continued unless otherwise specified. j Symbol Parameter Source-drain diode V source-drain (diode forward) SD voltage t reverse recovery time rr Q recovered charge r 9397 750 12049 Product data BUK95/96/9E3R2-40B Conditions ...
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Philips Semiconductors 350 10 4 Label ( 3.8 5 (A) 280 3.6 3.4 210 3.2 140 3 2.8 70 2.6 2.4 2 300 s ...
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Philips Semiconductors 2.5 V GS(th) (V) max 2.0 typ 1.5 min 1.0 0.5 0 Fig 9. Gate-source threshold voltage as a function of junction temperature. 200 g ...
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Philips Semiconductors 100 175 Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values ...
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Philips Semiconductors 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB ( DIMENSIONS (mm are the original dimensions UNIT A 1 4.5 1.39 0.9 1.3 mm ...
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Philips Semiconductors Plastic single-ended surface mounted package (Philips version of D (one lead cropped DIMENSIONS (mm are the original dimensions UNIT c 4.50 1.40 0.85 0.64 mm 4.10 1.27 0.60 0.46 ...
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Philips Semiconductors Plastic single-ended package (Philips version DIMENSIONS (mm are the original dimensions UNIT A b 4.5 1.40 0.9 1.3 mm 4.1 1.27 0.7 1.0 Note 1. Terminals ...
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Philips Semiconductors 8. Soldering handbook, full pagewidth 8.35 8.15 4.85 7.95 Dimensions in mm. Fig 19. Reflow soldering footprint for SOT404. 9397 750 12049 Product data 10.85 10.60 10.50 1.50 7.50 7.40 2.15 2.25 1.50 4.60 0.30 3.00 solder lands ...
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Philips Semiconductors 9. Revision history Table 6: Revision history Rev Date CPCN Description 04 20031114 - Product data (9397 750 12049) Modifications: • Addition of BUK9E3R2-40B type to data sheet. 03 20030116 - Product data (9397 750 10844) Modifications: • ...
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Philips Semiconductors Philips Semiconductors 10. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing ...
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Philips Semiconductors Contents 1 Product profi 1.1 Description . . . . . ...