saa5288 NXP Semiconductors, saa5288 Datasheet - Page 44

• Manufacturer Part Number: saa5288
• Description: Microcontroller With Full Screen Screen Display
• Manufacturer: NXP Semiconductors

Philips Semiconductors
14 EMC GUIDELINES
If possible, a ground plane under the whole IC should be
present, i.e. no signal tracks running underneath the IC as
shown in Fig.22.
The ground plane under the IC should be connected by the
widest possible connection back to the ground connection
of the PCB, and electrolytic decoupling capacitor. It should
preferably not connect to other grounds on the way and no
wire links should be present in this connection. The use of
wire links increases ground bounce by introducing
inductance into the ground, thereby reducing the
electrolytic capacitor’s decoupling efficiency.
The supply pins should be decoupled at the pin, to the
ground plane under the IC. This is easily accomplished
when using SM capacitors (which are also most effective
at high frequencies).
1997 Jun 24
handbook, full pagewidth
TV microcontroller with full screen
On Screen Display (OSD)
under-IC GND plane
GND connection
note: no wire links
other
GND
connections
Fig.22 Power supply and GND connections for SOT247-1.
GND
V DDM
5 V
electrolytic decoupling capacitor (2 F)
V DDD
V SSD
44
Each supply pin should be connected separately to the
power connection of the PCB, preferably via at least one
wire link which:
1. May be replaced by a ferrite or inductor at a later point
2. Will introduce a small amount of inductance.
Signals connected to the +5 V supply e.g. via pull-up
resistors, should be connected to the +5 V supply before
the wire link to the IC (i.e. not the IC side). This will prevent
if from being polluted and conduct or radiate noise onto
signal lines, which may then radiate themselves.
OSCGND should connect only to the crystal load
capacitors (and not GND).
if necessary
V DDA
SM decoupling capacitors (10 to 100 nF)
wire links
V SSA
IC
under-IC GND plane
Preliminary specification
MGL127
SAA5288