m36p0r8070e0 STMicroelectronics, m36p0r8070e0 Datasheet - Page 18

• Manufacturer Part Number: m36p0r8070e0
• Description: 256 Mbit X16, Multiple Bank, Multilevel, Burst Flash Memory 128 Mbit Burst Psram, 1.8 V Supply, Multichip Package
• Manufacturer: STMicroelectronics

Package mechanical
6
18/22
Package mechanical
To meet environmental requirements, ST offers these devices in ECOPACK® packages,
which have a lead-free second level interconnect. The category of second level interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6.
1. Drawing is not to scale.
E
TFBGA107 8 x 11 mm 9 x 12 active ball array, 0.8 mm pitch,
package outline
E1
BALL "B1"
FD
A
e
D1
D
b
A1
FE
e
SE
A2
TFBGA-Z2
M36P0R8070E0
ddd