le5712 Zarlink Semiconductor, le5712 Datasheet - Page 6

• Manufacturer Part Number: le5712
• Description: Dual Subscriber Line Interface Circuit
• Manufacturer: Zarlink Semiconductor

Thermal Shutdown.
Thermal shutdown is provided on a per channel basis to protect the die from excessive temperature. Persistent faults will produce
high power dissipation, and may result in the affected channel triggering its thermal shutdown detector (Minimum > 145º C). At
this point the power amplifiers are turned off and the device is in a disconnect like state, FLT and DET will be active. The thermal
shutdown detector has approximately 10º C of hysteresis. Thermal shutdown on one channel will not affect the operation of the
other channel.
The thermal performance of a thermally enhanced package is assured through optimized printed circuit board layout.The thermal
pad at the bottom of the package should be soldered down to printed circuit board. Refer to the Thermal Management for the
Le5711 and Le7512 Dual SLIC Devices Application Note for details.
CONNECTION DIAGRAM
Note:
1.
2.
3.
Pin 1 is marked for orientation.
NC = No Connect
The exposed heat sink pad on the bottom of the eTQFP package should be connected to VBAT pin - the SLIC side of the diode from battery
supply. Do not connect it to GND.
AGND/DGND
DET
IREF
VCC
CAS
C2
C1
C3
C1
C2
RD
1
1
1
2
2
2
1
2
3
4
5
6
7
8
9
10
11
44 43 42 41 40 39 38 37 36 35 34
12 13 14 15 16 17 18 19 20 21 22
Zarlink Semiconductor Inc.
44-Pin eTQFP
Exposed Pad
6
33
32
31
30
29
28
27
26
25
24
23
120402
BGND
BD
AD
DB
DAC
NC
VBAT
DB
AD
BD
BGND
1
1
1
2
2
2
1
2