isppac-powr6at6 Lattice Semiconductor Corp., isppac-powr6at6 Datasheet - Page 32

• Manufacturer Part Number: isppac-powr6at6
• Description: In-system Programmable Power Supply Monitoring And Margining Controller
• Manufacturer: Lattice Semiconductor Corp.

Lattice Semiconductor
Package Diagram
32-Pin QFN
Dimensions in millimeters
2X
PIN 1 ID
Note: If soldered to the circuit board for thermal considerations, insure the thermal pad is connected electrically to ground. Otherwise,
the thermal pad should not be connected electrically (must be left "floating").
For important information on the preferred mounting of QFN packages, refer to the following application note at:
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
0.20
SEATING
PLANE
2.
NOTES: UNLESS OTHERWISE SPECIFIED
1.
4
5
3
C
3
0.20
2X
C
B
C
A
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONS AND TOLERANCES
PER ANSI Y14.5M.
EXACT SHAPE AND SIZE OF THIS
FEATURE IS OPTIONAL.
DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.20 AND 0.25 mm FROM TERMINAL TIP.
APPLIES TO EXPOSED PORTION OF TERMINALS.
0
1
A
N
SIDE VIEW
TOP VIEW
5.00
4.75
2X
0.25
A3
4.75
A2
C
A1
A
A
5.00
B
2X
5
0.25
0.08
32
C
C
B
L
32X
SYMBOL
A1
A2
A3
D2
E2
A
b
L
e
0
ispPAC-POWR6AT6 Data Sheet
BOTTOM VIEW
e
1.25
1.25
0.18
0.30
0.00
0.00
3.5
MIN.
4X
D2
b
-
-
4
0.10
0.20 REF
0.50 BSC
N
0.85
0.24
0.40
2.70
2.70
0.01
0.65
NOM.
M
-
C
A
1
LOCATED IN THIS ARE
PIN #1 ID FIDUCIAL
B
3
1.00
0.05
1.00
3.25
3.25
0.30
0.50
E2
MAX.
12
DIEPAD
(EXPOSED BACKSIDE)
A