bh25nb1whfv ROHM Co. Ltd., bh25nb1whfv Datasheet - Page 6

• Manufacturer Part Number: bh25nb1whfv
• Description: High-ripple Rejection Cmos Ldo Regulators For High-frequency Circuits
• Manufacturer: ROHM Co. Ltd.

Output capacitors
Operation Notes
© 2009 ROHM Co., Ltd. All rights reserved.
BH□□NB1WHFV Series
www.rohm.com
Mounting input capacitor between input pin and GND(as close to pin as possible), and also output capacitor between output
pin and GND(as close to pin as possible) is recommended.
The input capacitor reduces the output impedance of the voltage supply source connected to the VCC.
The higher value the output capacitor goes, the more stable the whole operation becomes. This leads to high load transient response.
Please confirm the whole operation on actual application board.
Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its value
goes lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers.
1.
2.
3.
4.
5.
6.
7.
Absolute maximum ratings
Thermal design
Inter-pin shorts and mounting errors
Thermal shutdown circuit (TSD)
Overcurrent protection circuit
Action in strong electromagnetic field
Ground wiring pattern
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection
devices, such as fuses.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to
shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do
not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This
circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit
current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or
other component. These protection circuits are effective in preventing damage due to sudden and unexpected
accidents. However, the IC should not be used in applications characterized by the continuous operation or
transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has
negative characteristics to temperatures.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
Fig. 30 Stable Operation Region (Example)
0.01
100
0.1
10
1
0
BH□□NB1WHFV
Output Current I
50
Stable region
6/8
OUT
100
[mA]
150
C
Ta = +25°C
OUT
= 2.2 F
Technical Note
2009.04 - Rev.A