tza3043b NXP Semiconductors, tza3043b Datasheet - Page 20

• Manufacturer Part Number: tza3043b
• Description: Gigabit Ethernet/fibre Channel Transimpedance Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Physical characteristics of the bare die
2000 Mar 28
Glass passivation
Bonding pad dimension
Metallization
Thickness
Size
Backing
Attach temperature
Attach time
Gigabit Ethernet/Fibre Channel
transimpedance amplifier
PARAMETER
2.1 m PSG (PhosphoSilicate Glass) on top of 0.65 m oxynitride
minimum dimension of exposed metallization is 90
1.22 m W/AlCu/TiW
380 m nominal
1.03
silicon; electrically connected to GND potential through substrate contacts
<440 C; recommended die attach is glue
<15 s
1.30 mm (1.34 mm
2
)
20
VALUE
90 m (pad size = 100
TZA3043; TZA3043B
Product specification
100 m)