tza3011a NXP Semiconductors, tza3011a Datasheet - Page 5

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tza3011a

Manufacturer Part Number
tza3011a
Description
30 Mbit/s Up To 3.2 Gbit/s A-rate Tm Laser Drivers
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
9397 750 14437
Product data sheet
6.2 Pin description
Table 2:
Symbol
GND
V
V
DIN
DINQ
TEST
CIN
CINQ
GND
ALRESET
ENABLE
ALOP
ALMON
Fig 3. Bonding pad location TZA3011UH
CCA
CCD
ALRESET
GNDESD
GNDRF
GNDRF
GNDRF
GNDRF
TEST
CINQ
V
V
V
V
DINQ
Pin description TZA3011A and TZA3011B
CCD
CCD
CCA
CCA
CIN
DIN
Pin
die pad
1
2
3
4
5
6
7
8
9
10
11
12
10
12
13
14
15
11
1
2
3
4
5
6
7
8
9
Rev. 06 — 20 January 2005
16
Description
common ground plane for V
connected to ground
analog supply voltage
digital supply voltage
non-inverted data input (RF input)
inverted data input (RF input)
test pin or test pad; must be connected to ground
non-inverted clock input (RF input)
inverted clock input (RF input)
ground
alarm reset input; resets ALMON and ALOP alarms
enable input for modulation and bias current
alarm output on operating current (open-drain)
alarm output on monitor diode current (open-drain)
57
17
56
18
55
i.c.
i.c.
54
19
x
20
53
TZA3011UH
i.c.
30 Mbit/s up to 3.2 Gbit/s A-rate
21
0
22
52
y
0
TZA3011A; TZA3011B
2.56 mm
51
50
23
CCA
, V
49
24
CCD
48
25
, V
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
47
i.c.
i.c.
CCO
26
38
34
46
, RF and I/O; must be
45
44
43
42
41
40
39
37
36
35
33
32
30
29
28
31
27
V
V
BIAS
GNDO
LA
LA
LA
LA
GNDO
GNDO
GNDO
LAQ
LAQ
LAQ
LAQ
GNDO
PWA
CCO
CCO
laser drivers
mgu553
2.51
mm
5 of 30

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