lm2655mtcx-adj National Semiconductor Corporation, lm2655mtcx-adj Datasheet - Page 6

• Manufacturer Part Number: lm2655mtcx-adj
• Description: 2.5a High Efficiency Synchronous Switching Regulator
• Manufacturer: National Semiconductor Corporation

www.national.com
T
V
V
I
I
T
T
SINK
SOURCE
All Output Voltage Versions Electrical Characteristics
SD_HYST
RR
F
OH
OL
Specifications with standard typeface are for T
Range. V
Low-side Driver (LDR) Parameters
Specifications with standard typeface are for T
Range. V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but device parameter specifications may not be guaranteed under these conditions. For guaranteed specifications and test conditions, see
the Electrical Characteristics.
Note 2: The maximum allowable power dissipation is calculated by using P
ambient temperature, and θ
140˚C/W for T
allows the safe dissipation of more power. The Absolute Maximum power dissipation must be derated by 7.14 mW per ˚C above 25˚C ambient. The LM2655 actively
limits its junction temperatures to about 165˚C.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin.
Note 4: ESD susceptibility using the human body model is 500V for V
Note 5: Typical numbers are at 25˚C and represent the most likely norm.
Note 6: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%
production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
Note 7: Measured with respect to V
Note 8: Measured while switching in closed loop with Vin = 15V.
Note 9: Average output current limit obtained using typical application circuit. This figure is dependant on the the inductor used.
Note 10: Bond wire resistance accounts for approximately 40mΩ of R
Symbol
Symbol
IN
IN
JMAX
= 10V unless otherwise specified.
= 10V unless otherwise specified.
, T
Thermal Shutdown
Hysteresis Temperature
Logic High Level
Logic Low Level
LDR Sink Current
LDR Source Current
Rise Time
Fall Time
A
, and θ
JA
JA
Parameter
Parameter
is the junction-to-ambient thermal resistance of the specified package. The 893 mW rating results from using 150˚C, 25˚C, and
respectively. A θ
SW
.
JA
of 140˚C/W represents the worst-case condition of no heat sinking of the 16-pin TSSOP package. Heat sinking
V
V
LDR Voltage = 1V
LDR Voltage = 2V
C
C
J
J
IN
IN
GS
GS
= 25˚C, and those in boldface type apply over full Operating Temperature
= 25˚C, and those in boldface type apply over full Operating Temperature
= 10V
= 6.0V
=1000pF
=1000pF
SW(ON)
CB
, V
Conditions
Conditions
DMAX
SW
.
, LDR, and L
6
= (T
JMAX
− T
DELAY
A
)/θ
JA
.
, where T
(Note 6)
(Note 5)
Typical
Typical
JMAX
500
180
6.8
25
18
6
0
7
is the maximum junction temperature, T
(Continued)
(Note 5)
(Note 6)
Limit
Limit
0.05
6.6
5.8
V(max)
V(min)
V(min)
Units
Units
mA
mA
˚C
ns
ns
V
V
V
A
is the