24c01sc Microchip Technology Inc., 24c01sc Datasheet

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24c01sc

Manufacturer Part Number
24c01sc
Description
1k/2k 5.0v I 2 C? Serial Eeproms For Smart Cards
Manufacturer
Microchip Technology Inc.
Datasheet
FEATURES
• ISO Standard 7816 pad locations
• Low power CMOS technology
• Organized as a single block of 128 bytes (128 x 8)
• 2-wire serial interface bus, I
• 100 kHz and 400 kHz compatibility
• Self-timed write cycle (including auto-erase)
• Page-write buffer for up to 8 bytes
• 2 ms typical write cycle time for page-write
• ESD protection > 4 kV
• 1,000,000 E/W cycles guaranteed
• Data retention > 200 years
• Available for extended temperature ranges
DESCRIPTION
The
24C02SC are 1K-bit and 2K-bit Electrically Erasable
PROMs with bondpad positions optimized for smart
card applications. The devices are organized as a sin-
gle block of 128 x 8-bit or 256 x 8-bit memory with a
two-wire serial interface. The 24C01SC and 24C02SC
also have page-write capability for up to 8 bytes of data.
I
2
C is a trademark of Philips Corporation.
1999 Microchip Technology Inc.
- 1 mA active current typical
- 10 µA standby current typical at 5.5V
or 256 bytes (256 x 8)
- Commercial
Microchip
1K/2K 5.0V I
Technology
(C):
0°C to +70°C
2
C™ compatible
Inc.
2
C
24C01SC
Serial EEPROMs for Smart Cards
and
24C01SC/02SC
DIE LAYOUT
BLOCK DIAGRAM
SDA SCL
V
V
CONTROL
LOGIC
CC
SS
I/O
V
SDA
DC
SS
CONTROL
MEMORY
LOGIC
XDEC
DS21170D-page 1
SCL
V
CC
HV GENERATOR
PAGE LATCHES
R/W CONTROL
SENSE AMP
EEPROM
ARRAY
YDEC

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24c01sc Summary of contents

Page 1

... Electrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a sin- gle block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have page-write capability for bytes of data trademark of Philips Corporation ...

Page 2

... ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings* V ...................................................................................7.0V CC All inputs and outputs w.r.t. V ............... -0. Storage temperature .....................................-65°C to +150°C Ambient temp. with power applied ................-65°C to +125°C ESD protection on all pads............................................ Š4 kV *Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rat- ...

Page 3

... DAT SU DAT STA T AA 24C01SC/02SC Remarks (Note 1) (Note 1) After this period the first clock pulse is generated Only relevant for repeated START condition (Note 2) (Note 2) Time the bus must be free before a new transmission can start (Note 1), CB ð 100 pF (Note 3) Byte or Page mode 25° ...

Page 4

... START and STOP conditions, while the 24C01SC/02SC works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. ...

Page 5

... Page Write The write control byte, word address, and the first data byte are transmitted to the 24C01SC/02SC in the same R/W A way byte write. But instead of generating a stop condition, the master transmits up to eight data bytes to ...

Page 6

... FIGURE 4-1: BYTE WRITE S BUS ACTIVITY T CONTROL MASTER A BYTE R T SDA LINE S BUS ACTIVITY FIGURE 4-2: PAGE WRITE S BUS ACTIVITY T CONTROL MASTER A BYTE R T SDA LINE S BUS ACTIVITY DS21170D-page 6 WORD ADDRESS WORD ADDRESS (n) DATA ...

Page 7

... To perform this type of read operation, first the word address must be set. This is done by sending the word address to the 24C01SC/02SC as part of a write operation. After the word address is sent, the master generates a start con- dition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set ...

Page 8

... Sequential Read Sequential reads are initiated in the same way as a ran- dom read except that after the 24C01SC/02SC trans- mits the first data byte, the master issues an acknowledge as opposed to a stop condition in a ran- dom read. This directs the 24C01SC/02SC to transmit ...

Page 9

... It is pulled down to V through an internal SS resistor. 1999 Microchip Technology Inc. 24C01SC/02SC 8.0 DIE CHARACTERISTICS Figure 8-1 shows the die layout of the 24C01SC/02SC, including bondpad positions. Table 8-1 shows the actual coordinates of the bondpad midpoints with respect to the center of the die. FIGURE 8-1: DIE LAYOUT DIP V ...

Page 10

... NOTES: DS21170D-page 10 1999 Microchip Technology Inc. ...

Page 11

... Product Identification System To order or to obtain information (e.g., on pricing or delivery), please use the listed part numbers, and refer to the factory or the listed sales offices. 24C01SC/02SC — /S Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds ...

Page 12

... Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights.  2002 Microchip Technology Inc. ® MCUs. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, ...

Page 13

... Palazzo Taurus Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 01/18/02  2002 Microchip Technology Inc. ...

Page 14

... This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components. ...

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