bgf110 Infineon Technologies Corporation, bgf110 Datasheet - Page 4

• Manufacturer Part Number: bgf110
• Description: Sd Card Interface Esd Protection
• Manufacturer: Infineon Technologies Corporation

SD Card Interface ESD Protection
Feature
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Description
The BGF110 is an ESD protection for the SD Card interface using a green wafer level package. External pins are
protected up to 15 kV contact discharge according to IEC61000-4-2. A RF filter functionality provides very good
RF and EMI suppression on the digital lines with very low cross talk. Sensitivity of the line capacitance on the bias
voltage is very low. The wafer level package has a 400 m solder ball pitch and 250 m ball diameter (before ball
attach).
Type
BGF110
Table 1
Parameter
Voltage at all pins to GND
Operating temperature range
Storage temperature range
Maximum current at all pins
Electrostatic discharge according to IEC61000-4-2 (contact discharge)
Ext. IOs: A4, A5, B4, B5, C4, C5, D4, D5, E4, E5
Int. IOs: A1, A2, B1, B2, C1, C2, C3, D1, D2, E1, E2
1) Can be applied for 24 hours if thermal power dissipation into PCB is considered properly
Data Sheet
ESD protection for SD Card interface
Integrated ESD protection up to 15 kV contact discharge
Very good EMI filtering with very low cross talk
Green wafer level package with SnAgSu solder balls
400 m solder ball pitch
Maximum Ratings
Package
WLP-24-2
Symbol
V
T
T
I
V
V
max
Marking
BGF110
4
OP
STG
P
E
I
Min.
-14
-40
-65
-15
-2
Values
Typ.
SD Card Interface ESD Protection
Max.
14
+85
+150
113
15
2
1)
Chip
N0720
WLP-24-2
Unit
V
°C
mA
kV
kV
C
Note /
Test Condition
V2.2, 2007-07-04
BGF110