wts701 Winbond Electronics Corp America, wts701 Datasheet - Page 74

• Manufacturer Part Number: wts701
• Description: Winbond Single-chip Text-to-speech Processor
• Manufacturer: Winbond Electronics Corp America

11. TYPICAL APPLICATION CIRCUIT
The following schematic diagrams are extracted from the WTS-ES701 evaluation board schematic.
The evaluation system includes the following basic clusters:
WTS701 processor cluster working with 3.3V, including an 8-ohm speaker,
SPI connector to the host PC via the PC parallel port.
For more information about the evaluation system, please refer to the WTS-ES701 User’s Guide.
PG 1
PG 1
VCCD
1
2
3
4
5
6
7
CRYSTAL SOCKET
PAD_XTO
PAD_XTI
C23
.1UF
1
2
3
4
5
6
7
U6
VCCD
14
13
12
11
10
9
8
PG 1
C24
.1UF
14
13
12
11
10
9
8
VCCD
PAD_RDY
PAD_MISO
PAD_INTB
CSB
C26
.1UF
J7
3
2
1
C18
10PF
C19
10PF
PG 1,3
PG 1,3
PG 1,3
PG 1,3
PG 1,3
PG 1,3
PG 1,3
R12
PG 1,3
CSB
33K
PG 1,3
Y2
PG 1,3
XTAL
R9 33K
R10 33K
R11 33K
PAD_MOSI
PAD_SCLK
PAD_RESET
PAD_MISO
PAD_INTB
PAD_RDY
PAD_BCLK
PAD_SSB
PAD_DIN
VCCD
PAD_FS
PAD_XTI
PAD_XTO
VCCD
10
11
12
13
14
15
16
25
26
27
2
3
4
5
6
8
7
9
VSSA1
VCLK
VFS
VDX
MISO
XTI
XTO
VSSDN
VSSD
VCCD
VCCDN
INTB
MOSI
SSB
SCLK
CSB
RDY
RESET
U5
WTS701
AUXOUT
ATTCAP
VSSA3
VSSA2
AUXIN
VCCA
SPK+
SPK-
PAD_AUXIN
54
52
48
46
44
42
40
36
- 74 -
PAD_ATTCAP
PAD_AUXOUT
PAD_SPK+
PAD_SPK-
PAD_AUXIN
VCCA
VCCA
.1UF
R13
10K
C21
.1UF
C25
+
C20
4.7UF
MJ-3536N
VCCA
PAD_AUXOUT PG 1
J5
3
2
1
C17
.1UF
C22
.1UF
AUXIN
PAD_AUXIN PG 1
PAD_SPK+ PG 1
PAD_SPK- PG 1
PAD_ATTCAP PG 1
R8
10K
J4
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
J1
MJ-3536N
J2
MJ-3536N
3
2
1
3
2
1
GNDA
GND
VCCD
VCCA
PAD_RDY
PAD_RESET
PAD_ATTCAP
PAD_SPK-
PAD_SPK+
PAD_AUXOUT
PAD_SCLK
PAD_SSB
PAD_MOSI
PAD_INTB
PAD_XTI
PAD_XTO
PAD_MISO
PAD_DIN
PAD_FS
PAD_BCLK
AUXOUT
SPEAKER
WTS701
Label pins
of J4 with
signal
names.