isd2560x Winbond Electronics Corp America, isd2560x Datasheet - Page 4

• Manufacturer Part Number: isd2560x
• Description: Single-chip, Multiple-messages, Voice Record/playback Device 60-, 75-, 90-, And 120-second Duration
• Manufacturer: Winbond Electronics Corp America

4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
8. TIMING DIAGRAMS.......................................................................................................................... 16
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 30
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 35
14. VERSION HISTORY ....................................................................................................................... 41
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
9.1 Operating Conditions ................................................................................................................... 20
10.1. Parameters For Packaged Parts .............................................................................................. 21
10.2. Parameters For Die .................................................................................................................. 25
10.3. Parameters For Push-Button Mode.......................................................................................... 29
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 36
12.3. 28-Lead 8x13.4MM Plastic Thin Small Outline Package (TSOP) Type 1 ................................ 37
12.4. ISD2560/75/95/120 Product Bonding Physical Layout (Die)
7.2.1. Operational Modes Description............................................................................................ 12
10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 24
10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 28
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ISD2560/75/90/120