isd4003 Winbond Electronics Corp America, isd4003 Datasheet - Page 34

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isd4003

Manufacturer Part Number
isd4003
Description
Single-chip, Multiple-messages Voice Record/playback Devices 4-, 5-, 6-, And 8-minute Duration
Manufacturer
Winbond Electronics Corp America
Datasheet

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ISD4003 Series
Notes:
12.5. D
o
o
o
[1]
[2]
[3]
Die Dimensions (with scribe line)
Die Thickness
Pad Opening
The backside of die is internally connected to V
damage may occur.
Die thickness is subject to change, please contact Winbond as this thickness may change in the future.
Double bond is recommended if treated as one pad.
X: 166.6 ± 1 mils
Y: 274.9 ± 1 mils
11.5 ± 0.5 mils
Single pad: 90 x 90 microns
Double pad: 180 x 90 microns
IE
I
NFORMATION
[2]
[1]
- 34 -
SS
V
SSD
V
. It MUST NOT be connected to any other potential or
SSA
V
SSD
[3]
V
SSA
[3]
V
MISO
SSA
MOSI
AUD OUT
ISD4003
SS
SCLK
ISD4003 SERIES
AM CAP
V
CCD
V
CCD
ANA IN-
XCLK
ANA IN+
INT
V
CCA
RAC
[3]
V
CCA
V
SSA
[3]

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