tea1521t-n2 NXP Semiconductors, tea1521t-n2 Datasheet - Page 20

• Manufacturer Part Number: tea1521t-n2
• Description: Tea152x Family Smps Ics For Low-power Systems
• Manufacturer: NXP Semiconductors

Philips Semiconductors
24. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
9
10
11
12
13
13.1
14
15
16
16.1
16.2
16.2.1
16.2.2
16.3
16.3.1
16.3.2
16.3.3
16.4
17
18
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics. . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Handling information. . . . . . . . . . . . . . . . . . . . 15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Start-up and undervoltage lock-out . . . . . . . . . 5
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 5
Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 6
Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7
Minimum and maximum duty factor . . . . . . . . . 7
Overcurrent protection . . . . . . . . . . . . . . . . . . . 7
Short-circuit winding protection . . . . . . . . . . . . 7
Overtemperature protection . . . . . . . . . . . . . . . 8
Overvoltage protection . . . . . . . . . . . . . . . . . . . 8
Output characteristics of complete power plug. 8
Input characteristics of complete power plug . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . 12
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Through-hole mount packages . . . . . . . . . . . . 15
Soldering by dipping or by solder wave . . . . . 15
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15
Surface mount packages . . . . . . . . . . . . . . . . 15
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
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© Koninklijke Philips Electronics N.V. 2006
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information . . . . . . . . . . . . . . . . . . . . 19
SMPS ICs for low-power systems
TEA152x family
Document number: TEA152X_FAM_2
Date of release: 25 January 2006