sak-xc2766x-96f66l-ac Infineon Technologies Corporation, sak-xc2766x-96f66l-ac Datasheet - Page 108

• Manufacturer Part Number: sak-xc2766x-96f66l-ac
• Description: 16/32-bit Single-chip Microcontroller With 32-bit Performance
• Manufacturer: Infineon Technologies Corporation

Preliminary
5
In addition to the electrical parameters, the following specifcations ensure proper
integration of the XC2766X into the target system.
5.1
These parameters specify the packaging rather than the silicon.
Table 34
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer or 4-layer board without thermal vias.
2) Device mounted on a 4-layer board with thermal vias, exposed pad not soldered.
3) Device mounted on a 4-layer board with thermal vias, exposed pad soldered to the board.
Data Sheet
Package and Reliability
Packaging
Package Parameters (PG-LQFP-100)
Symbol
Ex × Ey –
P
R
DISS
ΘJA
Min.
–
–
106
Limit Values
Max.
6.2 × 6.2
1.0
49
37
22
XC2000 Family Derivatives
Package and Reliability
Unit Notes
mm –
W
K/W No thermal via
K/W 4-layer, no pad
K/W 4-layer, pad
–
V2.0, 2008-03
XC2766X
3)
1)
2)