sta33013tr STMicroelectronics, sta33013tr Datasheet - Page 51

no-image

sta33013tr

Manufacturer Part Number
sta33013tr
Description
2.0 Digital Audio Processor With Ffx Digital Modulator And Analog And Digital Inputs
Manufacturer
STMicroelectronics
Datasheet
STA330
11
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These package have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 17
outline
Figure 20. VFQFPN52 outline
below.
gives the package dimensions for the parameters shown in
Figure 20: VFQFPN52
Package information
®
51/55

Related parts for sta33013tr