sta333mlj13tr STMicroelectronics, sta333mlj13tr Datasheet - Page 13

• Manufacturer Part Number: sta333mlj13tr
• Description: Sound Terminal Tm 2 Channel Microless High Efficiency Digital Audio System
• Manufacturer: STMicroelectronics

STA333ML
7
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 8.
(1) "D” and “E" do not include mold flash or protrusions Mold flash
DIM.
D
E
A2
G1
a1
e3
A
G
H
M
N
O
Q
S
U
X
Y
b
c
e
F
h
k
L
T
(1)
(1)
or protrusions shall not exceed 0.15 mm per side(0.006”)
PowerSSO36 exposed pad mechanical data and package dimensions
10.10
10.10
MIN.
2.15
2.15
0.18
0.23
0.55
7.4
4.1
6.5
0
0.1
G
M
TYP.
mm
3.65
0.5
8.5
2.3
4.3
1.2
0.8
2.9
1.0
5˚
A
B
LEAD COPLANARITY
T
MAX.
0.075
10.50
10.50
2.47
2.40
0.36
0.32
0.10
0.06
0.40
0.90
b
10˚
7.6
4.7
7.3
e3
D
0.084
0.084
0.007
0.009
0.398
0.291
0.398
0.022
0.161
0.256
MIN.
e
0
0.019
0.335
0.090
0.169
0.047
0.031
0.114
0.144
0.039
inch
TYP.
5˚
A
MAX.
0.097
0.094
0.003
0.014
0.012
0.413
0.299
0.004
0.002
0.413
0.016
0.035
0.185
0.287
10˚
B
MECHANICAL DATA
PowerSSO-36
(exposed pad)
Y
OUTLINE AND
BOTTOM VIEW
Package information
hx45
7587131 A
L
13/15