sta2416 STMicroelectronics, sta2416 Datasheet - Page 37

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sta2416

Manufacturer Part Number
sta2416
Description
Bluetooth?? Baseband With Integrated Flash
Manufacturer
STMicroelectronics
Datasheet

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STA2416
10
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 18. LFBGA120 (10x10x1.4mm) mechanical data and package dimensions
DIM.
mD
aaa
bbb
ddd
eee
mE
SD
A1
A2
D1
D2
E1
E2
eD
eE
FD
FE
SE
fff
A
D
E
n
b
MIN.
0.20
0.25
9.90
9.90
0.50 basic
0.50 basic
0.25 basic
0.25 basic
10.00
10.00
TYP.
0.30
8.50
6.50
8.50
6.50
0.75
0.75
0.15
0.10
0.08
0.15
0.05
mm
1
Tolerance
MAX.
10.10
10.10
1.40
0.35
120 balls
18
18
0.008
0.010
0.390
0.390
MIN.
0.0098 basic
0.0098 basic
0.020 basic
0.020 basic
0.0039
0.0031
0.039
0.012
0.394
0.335
0.256
0.394
0.335
0.256
0.029
0.029
0.006
0.006
0.002
TYP.
inch
MAX.
0.055
0.014
0.398
0.398
Body: 10 x 10 x 1.4mm
Low Fine Ball Grid Array
MECHANICAL DATA
OUTLINE AND
LFBGA120
Package information
7513355 A
®
37/40

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