cy8c20180 Cypress Semiconductor Corporation., cy8c20180 Datasheet - Page 10

• Manufacturer Part Number: cy8c20180
• Description: Capsense Express -8 Configurable Ios
• Manufacturer: Cypress Semiconductor Corporation.

Ordering Information
Thermal Impedances by Package
Solder Reflow Peak Temperature
Notes
Document Number: 001-17346 Rev. *C
.
1. T
2. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
3. Earlier termed as QFN package.
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
CY8C20180-LDX2I
CY8C20180-SX2I
Ordering Code
16 COL
Package
16 SOIC
JA.
[3]
16 COL
Package
16 SOIC
[3]
Minimum Peak Temperature
Package Diagram
001-09116
51-85068
240 °C
240 °C
[2]
Package Type
16 COL
16 SOIC
Typical θ
[3]
79.96 °C
Maximum Peak Temperature
46 °C
JA
[1]
260 °C
260 °C
Temperature
Operating
Industrial
Industrial
CY8C20180
Page 10 of 12
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