xc2v1000-4fg256c Xilinx Corp., xc2v1000-4fg256c Datasheet - Page 94

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xc2v1000-4fg256c

Manufacturer Part Number
xc2v1000-4fg256c
Description
Virtex-ii Platform Fpgas
Manufacturer
Xilinx Corp.
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Table 3: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os
Virtex-II Pin Definitions
This section describes the pinouts for Virtex-II devices in the
following packages:
DS031-4 (v3.5) November 5, 2007
Product Specification
CS144
FG256
FG456
FG676
FF896
FF1152
FF1517
BG575
BG728
BF957
Package
CS144: wire-bond chip-scale ball grid array (BGA) of
0.80 mm pitch
FG256, FG456, and FG676: wire-bond fine-pitch BGA
of 1.00 mm pitch
FF896, FF1152, FF1517: flip-chip fine-pitch BGA of
1.00 mm pitch
BG575 and BG728: wire-bond BGA of 1.27 mm pitch
BF957: flip-chip BGA of 1.27 mm pitch
R
XC2V
40
88
88
-
-
-
-
-
-
-
-
XC2V
120
80
92
-
-
-
-
-
-
-
-
XC2V
250
172
200
92
-
-
-
-
-
-
-
XC2V
500
172
264
-
-
-
-
-
-
-
-
www.xilinx.com
XC2V
1000
172
324
432
328
-
-
-
-
-
-
Available I/Os
All of the devices supported in a particular package are
pinout compatible and are listed in the same table (one
table per package). In addition, the FG456 and FG676
packages are compatible, as are the FF896 and FF1152
packages. Pins that are not available for the smallest
devices are listed in right-hand columns.
Each device is split into eight I/O banks to allow for flexibility
in the choice of I/O standards (see the Virtex-II Data Sheet).
Global
power/ground pins, are listed at the end of each table.
Table 4
The FG256 pinouts
Virtex-II pinout tables are available on the distribution
CD-ROM, or on the web (at
XC2V
1500
392
528
392
-
-
-
-
-
-
-
provides definitions for all pin types.
pins,
Virtex-II Platform FPGAs: Pinout Information
XC2V
2000
456
624
408
624
-
-
-
-
-
-
including
(Table
XC2V
3000
484
720
516
684
-
-
-
-
-
-
6) is included as an example. All
http://www.xilinx.com
JTAG,
XC2V
4000
824
912
684
-
-
-
-
-
-
-
configuration,
XC2V
1,104
6000
824
684
-
-
-
-
-
-
-
Module 4 of 4
).
XC2V
1,108
8000
824
-
-
-
-
-
-
-
-
and
2

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