74lvc3g06dp NXP Semiconductors, 74lvc3g06dp Datasheet
74lvc3g06dp
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74lvc3g06dp Summary of contents
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Triple inverter with open-drain output Rev. 05 — 21 May 2007 1. General description The 74LVC3G06 provides three inverting buffers. The output of this device is an open drain and can be connected to other open-drain outputs to implement ...
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... Ordering information Table 1. Ordering information Type number Package Temperature range Name 74LVC3G06DP +125 C 74LVC3G06DC +125 C 74LVC3G06GT +125 C 74LVC3G06GM +125 C 4. Marking Table 2. Marking Type number 74LVC3G06DP 74LVC3G06DC 74LVC3G06GT 74LVC3G06GM 5. Functional diagram mnb032 Fig 1 ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 74LVC3G06 GND 4 001aab841 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) Fig 6. Pin configuration SOT902-1 (XQFN8) 6.2 Pin description Table 3. Pin description Symbol Pin SOT505-2, SOT765-1 and SOT833 GND ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin SOT505-2, SOT765-1 and SOT833 Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter +125 C amb V HIGH-level input IH voltage V LOW-level input IL voltage V LOW-level output OL voltage I input leakage current OFF-state output OZ current I power-off leakage OFF current I supply current ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter Conditions t propagation delay nA to nY; see power dissipation V = GND capacitance [1] Typical values are measured the same as t and t ...
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... NXP Semiconductors Table 9. Measurement points Supply voltage Input 1. 1.95 V 0.5 2 2.7 V 0.5 2.7 V 1 3.6 V 1 5.5 V 0.5 Test data is given in Table 10. Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance Z ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.65 mm 0.5 0.00 0.15 1.55 OUTLINE VERSION IEC SOT902 Fig 12 ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added type number 74LVC3G06GM (XQFN8/SOT902-1 package). • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Abbreviations ...