pck351 NXP Semiconductors, pck351 Datasheet - Page 16

• Manufacturer Part Number: pck351
• Description: 1 10 Clock Distribution Device With 3-state Outputs
• Manufacturer: NXP Semiconductors

Philips Semiconductors
14. Revision history
Table 12:
PCK351_2
Product data sheet
Document ID
PCK351_2
Modifications:
PCK351-01
Revision history
Release date
20051216
20020514
•
•
•
•
•
•
•
[4]
[5]
[6]
[7]
[8]
[9]
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
Section 2
Table 2 “Ordering
“T
Table 5 “Limiting
– removed (old) Table note [1]; this is now presented in the Definitions section
– symbol “I
– row “I
Table 6 “Recommended operating
– moved (old) Table note [1] to description below table title
– split row “t
Table 7 “Static
to “input clamping voltage”
Table 8 “Dynamic
– in descriptive line below table title: changed “t
– (V
– (V
– (V
– subheading “V
– (V
– (V
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
amb
changed from “-” to “2.0 ns”
“V
“3.3 ns” (typ), “5.9 ns” (max)
changed from “-” to “2.0 ns”
CC
CC
CC
CC
CC
CC
= 40 C to +85 C”
= 3.3 V) typical value for t
= 3.3 V) typical value for t
= 3.3 V) t
= 3.0 V to 3.6 V; T
= 3.0 V to 3.6 V) values for t
= 3.0 V to 3.6 V) t
CC
“Features”: deleted (old) 12th bullet
, I
Data sheet status
Product data sheet
Product data
O
GND
r
” changed to “I
, t
characteristics”: changed parameter description of V
f
”
” split to 2 rows, and parameter for each revised
values”:
r
CC
characteristics”:
information”: changed “Temperature range = 65 C to +150 C” to
and t
Rev. 02 — 16 December 2005
= 3.3 to 3.6 V; T
f
minimum values changed from “-” to “0.3 ns”; maximum values
r
amb
and t
O(sink)
= 40 C to +85 C”
f
minimum values changed from “-” to “0.3 ns”; maximum values
”
PLH
PHZ
conditions”:
1 : 10 clock distribution device with 3-state outputs
PLH
Change notice
-
853-2344 28198
amb
and t
and t
and t
= 0 C to +70 C” changed to
PHL
PZH
PHL
(A to Yn) changed from 3.6 ns to 3.8 ns
(OE to Yn) changed from 4.0 ns to 3.8 ns
r
(A to Yn) changed from “-” to “2.5 ns” (min),
= t
f
=
Doc. number
-
9397 750 09791
3.0 ns” to “t
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
IK
r
from “input diode voltage”
= t
f
=
Supersedes
PCK351-01
-
2.5 ns”
PCK351
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