mt36htf25672fy-667 Micron Semiconductor Products, mt36htf25672fy-667 Datasheet

mt36htf25672fy-667

Manufacturer Part Number

mt36htf25672fy-667

Description

2gb, 4gb X72, Dr 240-pin Ddr2 Sdram Fbdimm

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT36HTF25672FY-667.pdf (16 pages)

Current page: 1 of 16
Download datasheet (417Kb)

DDR2 SDRAM FBDIMM

MT36HTF25672F – 2GB

MT36HTF51272F – 4GB

For the component data sheets, refer to Micron’s Web site:

Features

• 240-pin, fully buffered dual in-line memory module

• Fast data transfer rates: PC2-4200, PC2-5300, or

• 2GB (256 Meg x 72), 4GB (512 Meg x 72)

• 3.2 Gb/s, 4 Gb/s, and 4.8 Gb/s link transfer rates

• SMBus interface to advanced memory buffer (AMB)

• High-speed, 1.5V differential, point-to-point link

• Fault-tolerant; can work around a bad bit lane in

• High-density scaling with up to eight FBDIMMs per

• In-band and out-of-band command access

• Deterministic protocol: enables memory controller

• Automatic DDR2 SDRAM bus and channel

• Transmitter de-emphasis reduces intersymbol

• MBIST and IBIST test functions

• Transparent mode for DRAM test support

• V

• Serial presence-detect (SPD) with EEPROM

• Gold edge contacts

• Dual rank

• Supports 95°C operation with 2X refresh

Table 1:

PDF: 09005aef829a1e4d/Source: 09005aef8297c0ad

HTF36C256_512x72F_RC_H.fm - Rev. A 9/07 EN

(FBDIMM)

PC2-6400

for configuration register access

between host controller and AMB

each direction

channel

to optimize DRAM accesses for maximum

performance; delivers precise control and

repeatable memory behavior

calibration

interference (ISI)

Speed

Grade

REF

-80E

-667

-53E

DDSPD

= 1.5V for AMB

= V

= 0.9V SDRAM command/address termination

= +3V to +3.6V for AMB and EEPROM

Q = +1.8V for DRAM

Key Timing Parameters

Industry Nomenclature

Products and specifications discussed herein are subject to change by Micron without notice.

PC2-6400

PC2-5300

PC2-4200

CL = 5

800

667

–

2GB, 4GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM

Data Rate (MT/s)

www.micron.com

CL = 4

Figure 1:

Notes: 1. Not recommended for new designs.

Options

• Package

• Frequency/CAS latency (CL)

• PCB height

533

PCB height: 30.35mm (1.19in)

– 240-pin DIMM (Pb-free)

– 2.5ns @ CL = 5 (DDR2-800)

– 3ns @ CL = 5 (DDR2-667)

– 3.75ns @ CL = 4 (DDR2-533)

– 30.35mm (1.19in)

Micron Technology, Inc., reserves the right to change products or specifications without notice.

CL = 3

400

240-Pin FBDIMM (MO-256 R/C H)

–

(ns)

12.5

RCD

12.5

(ns)

Marking

Features

-667

-53E

-80E

(ns)

Related parts for mt36htf25672fy-667

Related keywords

mt36htf25672fy-667 datasheet
mt36htf25672fy-667 data sheet
mt36htf25672fy-667 pdf datasheet
mt36htf25672fy-667 component
mt36htf25672fy-667 part
mt36htf25672fy-667 distributor
mt36htf25672fy-667 RoHS
mt36htf25672fy-667 datasheet download