ltl-81hm2h53 LiteOn Technology Corp., ltl-81hm2h53 Datasheet - Page 7

• Manufacturer Part Number: ltl-81hm2h53
• Description: Liteon Power Led
• Manufacturer: LiteOn Technology Corp.

1. Application
2. Storage
3. Cleaning
4. Lead Forming & Assembly
5. Soldering
Part No. : LTL-81HM2H53
BNS-OD-C131/A4
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
When soldering, For Lamp without stopper type and must be leave a minimum of 3 mm clearance
To avoided the Epoxy climb up on lead frame and was impact to non-soldering problem, Dipping the
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
from the base of the lens to the soldering point.
lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
Recommended soldering conditions :
Temperature
Soldering time
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
Soldering iron
300°C Max.
3 sec. Max.
(one time only)
LITE-ONTE TECHNOLOGY CORPRATION.
P r o p e r t y o f L i t e - O n O n l y
CAUTIONS
Pre-heat
Pre-heat time
Solder wave
Soldering time
Wave soldering
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
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