pmeg3010eh NXP Semiconductors, pmeg3010eh Datasheet
pmeg3010eh
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pmeg3010eh Summary of contents
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... PMEG3010EH; PMEG3010EJ; PMEG3010ET 1 A very low V Rev. 04 — 20 March 2007 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number ...
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... Ordering information Package Name Description - plastic surface-mounted package; 2 leads SC-90 plastic surface-mounted package; 2 leads - plastic surface-mounted package; 3 leads Marking codes Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers F Simplified outline Symbol [ 001aab540 [1] Marking code ...
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... PMEG3010EH PMEG3010EJ PMEG3010ET non-repetitive peak forward square wave; current t total power dissipation T PMEG3010EH PMEG3010EJ PMEG3010ET junction temperature ambient temperature storage temperature Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers F Min - ms; 0. amb ...
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... 100 500 1000 mA F reverse current diode capacitance MHz 300 s; 0.02. p Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers F Min Typ [ ...
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... (5) 0.3 0.4 0.5 V (V) F (1) T (2) T (3) T (4) T (5) T Fig 2. Reverse current as a function of reverse 120 C d (pF Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers ( ( ( ( ( ...
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... Fig 5. Package outline SOD123F Fig 7. Package outline SOT23 (TO-236AB) PMEG3010EH_EJ_ET_4 Product data sheet 1 A very low 1.2 1.0 0.55 0.35 0.25 0.10 04-11-29 Dimensions in mm Fig 6. Package outline SOD323F (SC-90) 3.0 2.8 3 2.5 1.4 2.1 1 1.9 Dimensions in mm Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers duty cycle = 006aaa812 1.35 1.15 0.5 1 0.3 2.7 1.8 2.3 1.6 2 0.40 0.25 1.1 0.9 0.45 0.15 0.48 ...
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... Reflow soldering is the only recommended soldering method. Dimensions in mm 3.05 2.80 2.10 1.60 1.65 0.95 0. Reflow soldering is the only recommended soldering method. Dimensions in mm Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers F [1] Packing quantity 3000 -115 -115 -215 Section 14. solder lands solder resist 1 ...
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... Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers F 1 solder lands 2.70 solder resist solder paste occupied area 0.60 Dimensions in mm (3x) sot023 solder lands solder resist occupied area Dimensions in mm preferred transport direction during soldering © NXP B.V. 2007. All rights reserved. ...
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... The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type numbers PMEG3010EH and PMEG3010EJ separated from data sheet PMEGXX10EH_EJ_SER_3 Type number PMEG3010ET added Section 1.1 “ ...
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... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 04 — 20 March 2007 PMEG3010EH/EJ/ET MEGA Schottky barrier rectifiers F © NXP B.V. 2007. All rights reserved ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: PMEG3010EH_EJ_ET_4 All rights reserved. Date of release: 20 March 2007 ...