da6282 Micro Analog Systems Oy, da6282 Datasheet
da6282
Related parts for da6282
da6282 Summary of contents
Page 1
... Output is either CMOS or a true sine wave resulting in lower harmonics than with clipped sine wave output. APPLICATIONS VCTCXO modules for mobile phones • VCTCXO modules for other applications • DA6282.004 16 October 2008 MAS6282 working continuously without 1 (7) ...
Page 2
... XIN 185 VDD 436 DA 1071 CLK 1342 OUT 1612 VC 209 XOUT 477 TIN 780 PV 1071 MOUT 1335 VSS 1612 DA6282.004 16 October 2008 TIN TEST VREF MOUT MUX f OUT Buffer+ divider y-coordinate 1229 1229 1229 1229 1229 152 152 152 ...
Page 3
... Crystal pulling sensitivity S Crystal Rs R Note 1: CDACF = 32 and CDACC = 8 Symbol Min V – V –0 -0 MAX T – ±100 LUT Conditions L S DA6282.004 16 October 2008 Max Unit Note 6 0 150 C mA Min Typ Max Unit 2.6 2.8 5 –40 ...
Page 4
... TBD -0.7 INF 20 START φ used. DD DA6282.004 16 October 2008 Max Unit Note 40.00 MHz 1) 40.00 MHz ppm/V 2) ±0.2 ppm 3) 8) ±0.2 ppm 4) 8) ±0.2 ppm 3) 9) ±0.2 ppm 4) 9) Vpp Vpp ...
Page 5
... Note 2: Pins CLK, DA and PV can either be connected to VSS or left floating, and pin TIN must be left floating in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. Note 4: See coordinates in pin description on page 2. VDD DA CLK MAS6282A XOUT TIN PV MOUT 1840 um Figure 2. IC outline. DA6282.004 16 October 2008 OUT 1360 um VSS 5 (7) ...
Page 6
... SAMPLES IN SBDIL 20 PACKAGE CLK VDD OUT 18 GND MOUT 17 Top marking YYWW = Year, Week XXXXX.X = Lot number TIN 15 XOUT XIN 12 11 Figure 14. MAS6282 package. DA6282.004 16 October 2008 6 (7) ...
Page 7
... Package type WA9 = 215 µm thick EWS tested wafer Tel. (09) 80 521 Tel. Int. +358 9 80 521 Telefax +358 9 805 3213 Email: info@mas-oy.com DA6282.004 16 October 2008 Comments Die Size 1.840 x 1.380 mm Die Size 1.840 x 1.380 mm Delivery format 00 = bare wafer 7 (7) ...