rfp-150-50tcgn-s Anaren Microwave, rfp-150-50tcgn-s Datasheet

rfp-150-50tcgn-s

Manufacturer Part Number

rfp-150-50tcgn-s

Description

Model Rfp-150-50tcgn-s Flangeless Termination

Manufacturer

Anaren Microwave

Datasheet

1.RFP-150-50TCGN-S.pdf (2 pages)

Current page: 1 of 2
Download datasheet (250Kb)

Features:

Outline Drawing

• RoHS Compliant

• 150 Watts

• DC – 3.0 GHz

• Beryllium oxide Ceramic

• Welded Silver Leads

• Non-Nichrome Resistive

• Low Return Loss

•

Element

100% Tested

Dimensions inches

Compliant

General Specifications

Electrical Specifications

Resistive Element

Substrate

Cover

Mounting Flange

Lead(s)

Operating Temperature

Tolerance is ±0.010”, unless otherwise specified. Designed to meet of exceed

applicable portions of MIL-E-5400. All dimensions in inches.

Resistance Value:

Power:

Frequency Range:

VSWR

Specification based on unit properly installed using suggested mounting instructions

and a 50 ohm nominal impedance. Specifications subject to change.

RoHS

and Reel For Pick and

Place Manufacturing.

Available on Tape

Model RFP-150-50TCGN-S

Thick film

Beryllium oxide ceramic

Alumina ceramic

Copper, nickel plated per QQ-N-290

99.9% pure silver (.005” thick)

-55 to +150°C (see de rating chart)

50 Ohms, ± 5%

150 Watts

DC – 3.0 GHz

1.40 : 1

Flangeless Termination

USA/Canada:

Toll Free:

Europe

150 Watts, 50

150-50TCGN-S (097) Rev B

(800) 544-2414

+44 2392-232392

(315) 432-8909

Ω Ω Ω Ω

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rfp-150-50tcgn-s Summary of contents

Page 1

... DC – 3.0 GHz • Beryllium oxide Ceramic • Welded Silver Leads • Non-Nichrome Resistive Element • Low Return Loss 100% Tested • Outline Drawing Dimensions inches Model RFP-150-50TCGN-S RoHS Compliant Flangeless Termination General Specifications Resistive Element Thick film Substrate Beryllium oxide ceramic Cover ...

Page 2

... Model RFP-150-50TCGN-S Typical Performance: Derating: USA/Canada: (315) 432-8909 Toll Free: (800) 544-2414 Europe: +44 2392-232392 RoHS Compliant Mounting Footprint and Procedure: SUGGESTED MOUNTING PROCEDURES: 1. MAKE SURE THAT THE DEVICES ARE MOUNTED ON FLAT SURFACES (.001" UNDER THE DEVICE) TO OPTIMIZE THE HEAT TRANSFER. 2. POSITION DEVICE ON MOUNTING SURFACE AND SOLDER IN PLACE USING AN APPROPRIATE TYPE SOLDER ...

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