NBB-300 RF Micro Devices, NBB-300 Datasheet - Page 4

• Manufacturer Part Number: NBB-300
• Description: CASCADABLE BROADBAND GaAs MMIC AMPLIFIER
• Manufacturer: RF Micro Devices

NBB-300
Die Sales Information
Die Packaging
Package Storage
Die Handling
4 of 12
• All segmented die are sold 100% DC-tested. Testing parameters for wafer-level sales of die material shall be nego-
• Segmented die are selected for customer shipment in accordance with RFMD Document #6000152 - Die Product
• Segmented die has a minimum sales volume of 100 pieces per order. A maximum of 400 die per carrier is allow-
• All die are packaged in GelPak ESD protective containers with the following specification:
• GelPak ESD protective containers are placed in a static shield bag. RFMD recommends that once the bag is
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit
• Unit packages should be kept in a dry nitrogen environment for optimal assembly, performance, and reliability.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit
• Proper ESD precautions must be taken when handling die material.
• Die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of twee-
• When using automated pick-up and placement equipment, ensure that force impact is set correctly. Excessive force
tiated on a case-by-case basis.
Final Visual Inspection Criteria
able.
O.D.=2"X2", Capacity=400 Die (20X20 segments), Retention Level=High(X0).
opened the GelPak/s should be stored in a controlled nitrogen environment. Do not press on the cover of a closed
GelPak, handle by the edges only. Do not vacuum seal bags containing GelPak containers.
zers. Do not touch die with any part of the body.
may damage GaAs devices.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
UNITS:
Inches
(mm)
Chip Outline Drawing - NBB-300-D
1
OUTPUT
Sales Criteria - Unpackaged Die
.
Chip Dimensions: 0.017” x 0.017” x 0.004”
0.017 ± 0.001
(0.44 ± 0.03)
GND
VIA
INPUT
0.017 ± 0.001
(0.44 ± 0.03)
0.004 ± 0.001
Back of chip is ground.
(0.10 ± 0.03)
Rev A11 DS070328
2
2
.
.