SBT-BGA-7000 Ironwood Electronics, SBT-BGA-7000 Datasheet - Page 3

• Manufacturer Part Number: SBT-BGA-7000
• Description: Socket For Burn-In and Test Applications; Max Pincount: 484; Top Pitch (mm): 0.5; IC Array X: 22; IC Array Y: 22; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.5; IC Siz
• Manufacturer: Ironwood Electronics

Description: BGA with 484 pin with 0.5mm Pitch
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
A
E
www.ironwoodelectronics.com
Ironwood Electronics, Inc.
Tele: [phone]
Z
SBT-BGA-7000 Drawing
b
SCALE 10 : 1
DETAIL C
D
WEIGHT:
MATERIAL:
FINISH:
0.1 Z
0.08 Z
C
A1
0.1
0.05 Z X Y
0.05 Z
STATUS: Released
DRAWN BY: Vinayak R
File: SBT-BGA-7000 Dwg
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to
datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder
balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of
package.
e
b
DIM
A1
A
D
E
b
e
22x22 Full Array
Minimum
0.25
0.2
SHEET 3 OF 4
SCALE: 5:1
DATE: 5/13/2009
12.0 BSC
12.0 BSC
0.5 BSC
Maximum
2.5
0.4
0.4
REV. A