STQ3016Z ETC, STQ3016Z Datasheet - Page 2

• Manufacturer Part Number: STQ3016Z
• Description: (STQ-x016Z) Reliability Qualification Report
• Manufacturer: ETC

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STQ-2016Z Reliability Qualification Report
I. Qualification Overview
The STQ-2016Z family of products has demonstrated reliable operation by passing all
qualification testing in Sirenza Microdevices' product qualification test plan. The
STQ-2016Z has been subject to stresses such as humidity (autoclave), extreme hot and
cold environments (temperature cycling), moisture sensitivity (MSL-1 and solder reflow
testing), and several others as part of the qualification process.
II. Introduction
The Sirenza Microdevices’ STQ-2016Z is a direct quadrature modulator targeted for use
in a wide range of communications systems, including cellular/PCS, CDMA2000, UMTS,
and ISM data com. This device features a wide 700-2500 MHz operating frequency
band, excellent carrier and sideband suppression, and a low broadband noise floor.
III. Fabrication Technology
These amplifiers are manufactured using a Silicon Germanium Heterojunction Bipolar
Transistor (HBT) technology. This patented self-aligned emitter, double poly HBT
process has been in production by our foundry since 1998. The process has been
successfully used for a wide range of RFIC products including GSM PAs, DECT front
end transceivers, LNAs & VCOs. This process offers comparable performance to GaAs
HBTs with the added advantages of mature and highly reproducible Silicon wafer
processing.
IV. Package Type
The STQ-2016Z is packaged in a plastic encapsulated TSSOP-16 package that is
assembled using a highly reproducible automated assembly process. The die is mounted
using an industry standard thermally and electrically conductive silver epoxy. The die is
mounted directly to the exposed paddle to provide a low thermal resistance path for heat
conduction out of the package.
Figure 1 : Image of TSSOP -16 Exposed Paddle Plastic Package
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