BCM857DS NXP Semiconductors, BCM857DS Datasheet
BCM857DS
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BCM857DS Summary of contents
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... Product profile 1.1 General description PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic packages. The transistors are fully isolated internally. Table 1. Type number BCM857BV BCM857BS BCM857DS 1.2 Features I Current gain matching I Base-emitter voltage matching I Drop-in replacement for standard double transistors 1.3 Applications ...
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... Ordering information Table 4. Type number BCM857BV BCM857BS BCM857DS 4. Marking Table 5. Type number BCM857BV BCM857BS BCM857DS [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BCM857BV_BS_DS_6 Product data sheet Quick reference data …continued Parameter Conditions h matching ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors Table 7. Symbol Parameter Per device R thermal resistance from th(j-a) junction to ambient [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table unless otherwise specified amb Symbol ...
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... NXP Semiconductors Table unless otherwise specified amb Symbol Per device h /h FE1 FE2 V V BE1 BE2 [1] V decreases by about 1.7 mV/K with increasing temperature. BEsat [2] V decreases by about 2 mV/K with increasing temperature. BE [3] The smaller of the two values is taken as the numerator. ...
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... NXP Semiconductors 0.20 I (mA (A) 0.16 0.12 0.08 0. amb Fig 1. Collector current as a function of collector-emitter voltage; typical values 1.3 V BEsat (V) 1.1 0.9 (1) (2) 0.7 (3) 0.5 0 amb ( amb ( 100 C amb Fig 3. Base-emitter saturation voltage as a function of collector current ...
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... NXP Semiconductors (V) 0.8 0.6 0 amb Fig 5. Base-emitter voltage as a function of collector current; typical values (pF MHz amb Fig 7. Collector capacitance as a function of collector-base voltage; typical values BCM857BV_BS_DS_6 Product data sheet ...
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... NXP Semiconductors 8. Application information out TR1 TR2 006aaa524 Fig 9. Current mirror 9. Package outline 1.7 1 1.7 1.3 1.5 1.1 pin 1 index 0.5 1 Dimensions in mm Fig 11. Package outline SOT666 3.0 2.5 Fig 13. Package outline SOT457 (SC-74) BCM857BV_BS_DS_6 Product data sheet Fig 10. Differential amplifier 0.6 0.5 4 0.3 0.1 2.2 1.35 2.0 1.15 0.18 0.27 0.08 0.17 Dimensions in mm 04-11-08 Fig 12. Package outline SOT363 (SC-88) 3 ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BCM857BV BCM857BS BCM857DS [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BCM857BV_BS_DS_6 Product data sheet ...
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... NXP Semiconductors 11. Soldering 1.075 2 1.7 Reflow soldering is the only recommended soldering method. Fig 14. Reflow soldering footprint SOT666 2.35 Fig 15. Reflow soldering footprint SOT363 (SC-88) BCM857BV_BS_DS_6 Product data sheet 2.75 2.45 2.1 1.6 0.538 0. 1.7 0.45 0 0.5 0. 2.65 1.5 0.6 0 0 1.8 Rev. 06 — 28 August 2009 BCM857BV/BS/DS www.DataSheet4U.com PNP/PNP matched double transistors solder lands 0 ...
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... NXP Semiconductors 4.5 Fig 16. Wave soldering footprint SOT363 (SC-88) 3.30 Dimensions in mm Fig 17. Reflow soldering footprint SOT457 (SC-74) BCM857BV_BS_DS_6 Product data sheet 1.3 1.3 2.45 5.3 3.45 1.95 0.95 2.825 1.60 1.70 3.10 3.20 Rev. 06 — 28 August 2009 BCM857BV/BS/DS www.DataSheet4U.com PNP/PNP matched double transistors 1.5 solder lands 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering ...
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... NXP Semiconductors 5.05 Dimensions in mm Fig 18. Wave soldering footprint SOT457 (SC-74) BCM857BV_BS_DS_6 Product data sheet BCM857BV/BS/DS PNP/PNP matched double transistors 5.30 0.45 1.45 4.45 1.40 4.30 Rev. 06 — 28 August 2009 www.DataSheet4U.com solder lands solder resist occupied area msc423 © NXP B.V. 2009. All rights reserved ...
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... Document ID Release date BCM857BV_BS_DS_6 20090828 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 12 “Package outline SOT363 • Figure 14 “Reflow soldering footprint • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Revision history ...