LM4867MT National Semiconductor, LM4867MT Datasheet - Page 14

• Manufacturer Part Number: LM4867MT
• Description: Output-Transient-Free Dual 2.1W Audio Amplifier Plus No Coupling Capacitor Stereo Headphone Function
• Manufacturer: National Semiconductor

www.national.com
Application Information
present on the internal amplifier’s input may change. This
change can slew at a rate that may produce audible voltage
transients or clicks in the amplifier’s output signal. Using the
MUX to select between two vastly dissimilar gains is a typical
transient-producing situation. As the MUX is switched, an
audible click may occur as the gain suddenly changes.
PIN OUT COMPATIBILITY WITH THE LM4863
The LM4867 pin out was designed to simplify replacing the
LM4863: except for the four Pins(-IN A
and NC) that implement the LM4867’s extra functionality, the
LM4867MT/MTE and LM4863MT/MTE pin outs match.
(Note 19)
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4867’s exposed-DAP (die attach paddle) packages
(MTE and LQ) provide a low thermal resistance between the
die and the PCB to which the part is mounted and soldered.
This allows rapid heat transfer from the die to the surround-
ing PCB copper area heatsink, copper traces, ground plane,
and finally, surrounding air. The result is a low voltage audio
power amplifier that produces 2.4W dissipation in a 4Ω load
at ≤ 1% THD+N and over 3W in a 3Ω load at 10% THD+N.
This high power is achieved through careful consideration of
necessary thermal design. Failing to optimize thermal design
may compromise the LM4867’s high power performance and
activate unwanted, though necessary, thermal shutdown
protection.
The MTE and LQ packages must have their DAPs soldered
to a copper pad on the PCB. The DAP’s PCB copper pad is
then, ideally, connected to a large plane of continuous un-
broken copper. This plane forms a thermal mass, heat sink,
and radiation area. Place the heat sink area on either outside
plane in the case of a two-sided or multi-layer PCB. (The
heat sink area can also be placed on an inner layer of a
multi-layer board. The thermal resistance, however, will be
higher.) Connect the DAP copper pad to the inner layer or
backside copper heat sink area with 32 (4 X 8) (MTE) or 6 (3
X 2) (LQ) vias. The via diameter should be 0.012in - 0.013in
with a 1.27mm pitch. Ensure efficient thermal conductivity by
plugging and tenting the vias with plating and solder mask,
respectively.
FIGURE 6. As configured, connecting headphones to this jack automatically selects the stereo headphone amplifier
and, with the additional NC switch, changes MUX channels (Network 2 in Figure 5 )
2
, MUX CTRL, -IN B
(Continued)
2
,
14
Note 19: If the LM4867 replaces an LM4863 and the input MUX circuitry is
not being used, the LM4867 MUX CTRL pin must be tied to V
the unused MUX inputs must be connected to GND.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
necessary for 5V operation with a 4Ω load. Heatsink areas
not placed on the same PCB layer as the LM4867 should be
5in
The last two area recommendations apply for 25˚C ambient
temperature. Increase the area to compensate for ambient
temperatures above 25˚C. In systems using cooling fans, the
LM4867MTE can take advantage of forced air cooling. With
an air flow rate of 450 linear-feet per minute and a 2.5in
exposed copper or 5.0in
the LM4867MTE can continuously drive a 3Ω load to full
power. The LM4867LQ achieves the same output power
level without forced-air cooling. In all circumstances and
under all conditions, the junction temperature must be held
below 150˚C to prevent activating the LM4867’s thermal
shutdown protection. The LM4867’s power de-rating curve in
the Typical Performance Characteristics shows the maxi-
mum power dissipation versus temperature. Example PCB
layouts for the exposed-DAP TSSOP and LQ packages are
shown in the Demonstration Board Layout section. Further
detailed and specific information concerning PCB layout and
fabrication and mounting an LQ (LLP) is found in National
Semiconductor’s AN1187.
2
(min) for the same supply voltage and load resistance.
20001339
2
inner layer copper plane heatsink,
2
(min) area is
DD
or GND and
2