MC100EP33DTG ON Semiconductor, MC100EP33DTG Datasheet - Page 10

• Manufacturer Part Number: MC100EP33DTG
• Description: IC DIVIDER DIV X4 ECL CLK 8TSSOP
• Manufacturer: ON Semiconductor
• Series: 100EPr

Specifications of MC100EP33DTG

• Logic Type: Divide-by-4
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Reset: Asynchronous
• Count Rate: 4GHz
• Trigger Type: Positive, Negative
• Voltage - Supply: 3.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Direction: -
• Timing: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC100EP33DTGOS

0.15 (0.006) T
0.15 (0.006) T
−T−
0.10 (0.004)
SEATING
PLANE
L
U
U
S
S
PIN 1
IDENT
D
2X
L/2
C
8
1
−V−
A
8x
4
5
K
G
0.10 (0.004)
REF
−U−
B
PLASTIC TSSOP PACKAGE
PACKAGE DIMENSIONS
M
http://onsemi.com
T
CASE 948R−02
DT SUFFIX
U
TSSOP−8
DETAIL E
ISSUE A
S
10
DETAIL E
V
S
F
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. TERMINAL NUMBERS ARE SHOWN FOR
6. DIMENSION A AND B ARE TO BE DETERMINED
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
REFERENCE ONLY.
AT DATUM PLANE -W-.
DIM
M
A
B
C
D
F
G
K
L
MILLIMETERS
MIN
2.90
2.90
0.80
0.05
0.40
0.25
0
0.65 BSC
4.90 BSC
_
MAX
3.10
3.10
1.10
0.15
0.70
0.40
6
_
0.031
0.002
0.016
0.010
0.114
0.114
MIN
0.026 BSC
0.193 BSC
0
INCHES
_
0.122
0.122
0.043
0.006
0.028
0.016
MAX
6
_