MC10E122 ON Semiconductor, MC10E122 Datasheet - Page 5

• Manufacturer Part Number: MC10E122
• Description: 9-BIT BUFFER
• Manufacturer: ON Semiconductor

Table 7. AC CHARACTERISTICS
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
9. 10 Series: V
10. Within-device skew is defined as identical transitions on similar paths through a device.
11. Devices are designed to meet the AC specifications shown in the above table, after thermal equilibrium has been established. The circuit
Symbol
f
t
t
t
t
t
t
MAX
PLH
PHL
SKEW
JITTER
r
f
100 Series: V
is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Maximum Toggle Frequency
Propagation Delay to Output
Within-Device Skew
Random Clock Jitter (RMS)
Rise/Fall Times
(20 - 80%)
EE
EE
can vary −0.46 V / +0.06 V.
can vary −0.46 V / +0.8 V.
Characteristic
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Figure 3. Typical Termination for Output Driver and Device Evaluation
Driver
Device
D to Q (Note 10)
V
CCx
Q
Q
= 5.0 V; V
D to Q
EE
= 0.0 V or V
Min
150
300
Z
Z
http://onsemi.com
o
o
= 50 W
= 50 W
0°C
Typ
800
350
425
< 1
75
50 W
V
5
CCx
TT
= 0.0 V; V
= V
Max
500
800
V
CC
TT
− 2.0 V
50 W
EE
Min
150
300
= −5.0 V (Note 7)
25°C
Typ
800
350
425
< 1
75
D
D
Max
500
800
Receiver
Device
Min
150
300
85°C
Typ
800
350
425
< 1
75
Max
500
800
MHz
Unit
ps
ps
ps
ps