AMBE2000 ETC, AMBE2000 Datasheet - Page 10

• Manufacturer Part Number: AMBE2000
• Description: VOCODER CHIP
• Manufacturer: ETC

3 Hardware Information
3.1
The AMBE-2000 uses the TM320-LC541-66 core. For more details on handeling, electrical characteristics, packaging, or
timing constraints please refer to the TMS320-C54x manual found at
(Adobe Acrobat). Although the AMBE-2000™ Vocoder Chip incorporates input protection circuitry, to avoid damage from
the accumulation of a static charge, industry standard electrostatic discharge precautions and procedures must be employed
during handling and mounting.
The 100 pin TQFP package design of the AMBE-2000™ Vocoder Chip allows it to be mounted by infrared reflow, vapor-
phase reflow or equivalent processes. The peak package body temperature must not exceed 220 C.
The AMBE-2000™ Vocoder Chip requires baking before mounting, if any of the following conditions exist:
DVSI’s recommended bake out procedures:
3.1.1 Storage
To insure maximum shelf life in long term storage, AMBE-2000™ Vocoder Chips should be kept in a moisture controlled
package at <40 C and <90% Relative Humidity
Special Handling Instructions
Humidity indicator card (included in packaging) shows exposure to > 20 %
when read at 23 C + 5 C
Devices were not shipped in a package designated as “moisture
controlled.”
Not mounted within 168 hours of receipt, at factory conditions of <30 C
and <60% RH
If the device has not been stored at < 20% RH
For low-temperature device containers: 192 hours at 40 C + 5 C / -0 C
and < 5% Relative Humidity
For high-temperature device containers : 24 hours at 125 C + 5 C.
Confidential Proprietary, Subject to Change
User’s Manual Version 3.0
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