MPC961C Motorola, MPC961C Datasheet - Page 7

• Manufacturer Part Number: MPC961C
• Description: LOW VOLTAGE ZERO DELAY
• Manufacturer: Motorola

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layout and can be used to fine-tune the effective delay
through each device. In the following example calculation a
I/O jitter confidence factor of 99.7% ( 3 s ) is assumed,
resulting in a worst case timing uncertainty from input to any
output of -275 ps to 315 ps relative to CCLK:
t SK(PP) =
t SK(PP) =
Figure 8. “Max. I/O Jitter versus frequency” can be used for
a more precise timing performance analysis.
Power Consumption of the MPC961C and Thermal
Management
entire operating frequency range up to 200 MHz. The
MPC961C power consumption and the associated long-term
reliability may decrease the maximum frequency limit,
depending on operating conditions such as clock frequency,
supply voltage, output loading, ambient temperature, vertical
P
TIMING SOLUTIONS
DL207 — Rev 0
Table 8: Confidence Facter CF
TOT
The feedback trace delay is determined by the board
Due to the frequency dependence of the I/O jitter,
The MPC961C AC specification is guaranteed for the
CF
1 s
2 s
3 s
4 s
5 s
6 s
+
Figure 8. Max. I/O Jitter versus frequency
V
CC
@
Probability of clock edge within the distribution
[–80ps...120ps] + [–150ps...150ps] +
[(15ps
[–275ps...315ps] + t PD, LINE(FB)
I
CCQ
f
)
CLOCK,MAX
P
@
TOT
V
–3)...(15ps
CC
+
@
f
CLOCK
0.68268948
0.95449988
0.99730007
0.99993663
0.99999943
0.99999999
+
I
CCQ
C
PD
)
@
Freescale Semiconductor, Inc.
@
@
V
3)] + t PD, LINE(FB)
T
N
N
For More Information On This Product,
1
CC
J
@
@
+
@
V
C
f
T
PD
2
CC
CLOCK
A
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Go to: www.freescale.com
P
T
@
M
TOT
J,MAX
C
N
R
L
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thja
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C
thja
T
PD
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7
P
M
convection and thermal conductivity of package and board.
This section describes the impact of these parameters on the
junction temperature and gives a guideline to estimate the
MPC961C die junction temperature and the associated
device reliability. For a complete analysis of power
consumption as a function of operating conditions and
associated long term device reliability please refer to the
application note AN1545. According the AN1545, the
long-term device reliability is a function of the die junction
temperature:
junction temperature and impact the device reliability
(MTBF). According to the system-defined tolerable MTBF,
the die junction temperature of the MPC961C needs to be
controlled and the thermal impedance of the board/package
should be optimized. The power dissipated in the MPC961C
is represented in equation 1.
MPC961C, C PD is the power dissipation capacitance per
output,
load, N is the number of active outputs (N is always 27 in
case of the MPC961C). The MPC961C supports driving
transmission lines to maintain high signal integrity and tight
timing parameters. Any transmission line will hide the lumped
capacitive load at the end of the board trace, therefore, C L is
zero for controlled transmission line systems and can be
eliminated from equation 1. Using parallel termination output
termination results in equation 2 for power dissipation.
parallel or thevenin termination, V OL , I OL , V OH and I OH are a
function of the output termination technique and DC Q is the
clock signal duty cyle. If transmission lines are used C L is
zero in equation 2 and can be eliminated. In general, the use
of controlled transmission line techniques eliminates the
impact of the lumped capacitive loads at the end lines and
greatly reduces the power dissipation of the device. Equation
3 describes the die junction temperature T J as a function of
the power consumption.
DC
I
CCQ
Table 9: Die junction temperature and MTBF
C
Increased power consumption will increase the die
Where I CCQ is the static current consumption of the
In equation 2, P stands for the number of outputs with a
Q
L
Junction temperature ( C)
@
@
V
I
OH
CC
@
@
V
CC
V
C L represents the external capacitive output
100
120
130
CC
110
*
V
OH
)
1
*
DC
Q
@
MTBF (Years)
I
OL
20.4
@
9.1
4.2
2.0
V
MPC961C
OL
Equation 1
MOTOROLA
Equation 3
Equation 4
Equation 2